SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
MIMX9332XVVXMAB is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is MIMX9332XVVXMAB. Review the specifications below when checking this part for your BOM.
The MIMX9332XVVXMAB is an Extended Industrial grade application processor from the NXP i.MX 93 family. It features two Arm Cortex-A55 cores operating at a maximum frequency of 1.7 GHz and one Arm Cortex-M33 core running up to 250 MHz. The device includes 640 kB of on-chip RAM, 256 kB of cluster L3 cache with ECC protection, and supports LPDDR4/LPDDR4X memory interfaces up to 3.7 GT/s. It operates within a temperature range of -40°C to +125°C.
Verify that the specific part number matches the Extended Industrial temperature grade requirements for your application environment. Confirm package compatibility with the 11 x 11 mm FCBGA-306 footprint during PCB layout. Ensure power supply sequencing aligns with the dedicated PMIC specifications outlined in the reference manual.
Select this component when extended industrial temperature ratings are mandatory. The dual-core A55 configuration provides sufficient performance for gateway applications requiring low latency. Verify that the absence of an integrated NPU meets your machine learning inference requirements, as this variant does not include the microNPU found in other derivatives.
This processor belongs to the i.MX 93 series, designed for power-optimized smart home, building control, and IoT edge applications. It utilizes the Energy Flex architecture to balance performance and efficiency. The 'X' designation indicates the Extended Industrial temperature grade, distinguishing it from Commercial, standard Industrial, and Automotive variants within the same silicon family.
Direct functional replacements within the i.MX 93 family include MIMX9332XVTXMAC, which shares identical electrical characteristics but utilizes a 14 x 14 mm FCBGA-306 package instead of the 11 x 11 mm form factor. Designers must account for pinout differences and thermal dissipation changes when substituting packages.
Explore related parts through Embedded, Integrated Circuits (ICs), all product categories, ChipApex homepage.