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The MIXG240W1200TEH is a high-power IGBT module manufactured by IXYS, designed for demanding industrial power electronics applications. It features a six-pack configuration utilizing Silicon technology and XPT (Extra Punch Through) architecture to optimize switching performance and conduction losses. The device supports a maximum collector-emitter voltage of 1200 V and delivers a continuous collector current of 240 A at 25°C. With a saturated collector-emitter voltage of 3.6 V and a power dissipation rating of 980 W, it provides robust thermal handling capabilities. The module is housed in an E3-Pack screw-mount package, operating reliably within a temperature range of -40°C to +175°C.
Verify the specific suffix TEH against official IXYS documentation to confirm pinout compatibility and terminal plating specifications. Ensure that the ordering information matches the exact datasheet revision required for your design. Cross-reference the manufacturer part number with authorized distributors to confirm current availability status and lead times before finalizing procurement plans.
Select this component when designing high-power conversion systems requiring 1200V blocking capability and currents exceeding 200A. Evaluate the thermal resistance characteristics of the E3-Pack to ensure adequate heatsinking solutions are implemented. Compare the 3.6V saturation voltage against alternative modules to determine overall system efficiency targets and cooling requirements for the specific application environment.
This module belongs to the MIXG series of high-power IGBTs from IXYS, which are engineered for heavy-duty industrial use. The series utilizes advanced trench gate and field stop technologies to enhance performance over previous generations. It serves as a critical switching element in medium-voltage power conversion architectures where reliability under high stress conditions is paramount.
Direct replacements must match the 1200V/240A rating and E3-Pack footprint. Verify electrical parameters such as Vce(sat) and switching times against the original datasheet. Check for mechanical pin compatibility and thermal interface requirements to ensure seamless integration into existing PCB or busbar designs without modification.