MM74HCT04SJ

Inverter Gates Overview

The MM74HCT04SJ is a hex inverter manufactured by onsemi, belonging to the HCT logic series. It utilizes CMOS technology and features six independent inverting channels within a single package. The device operates with a supply voltage range of 4.5V to 5.5V and supports surface mount installation in a 14-pin SOP package. It provides LSTTL-compatible outputs and maintains low static power consumption.

Inverter Gates Feature Summary

• Provides six independent inverting channels for signal inversion applications
• Features LSTTL-compatible output drive capabilities
• Operates reliably across an extended industrial temperature range

Inverter Gates Applications

• General-purpose digital signal inversion
• Logic level translation between CMOS and TTL systems
• Clock signal buffering and conditioning

Inverter Gates Procurement Notes

Verify the specific suffix SJ against the manufacturer's current datasheet to confirm pinout compatibility and package dimensions. Ensure the procurement channel sources components directly from authorized distributors to guarantee authenticity and traceability. Check for RoHS compliance status as per the latest environmental declarations.

Inverter Gates Selection Notes

Select this component when a high-density hex inverter solution is required in a standard SOP-14 footprint. It is suitable for designs needing LSTTL output compatibility while maintaining CMOS input characteristics. Consider the operating temperature range and supply voltage requirements to ensure alignment with the target system environment.

Inverter Gates Part Context

This part belongs to the MM74HCT04 family of hex inverters produced by onsemi. The HCT series is designed to be compatible with standard TTL logic levels while offering the low power consumption advantages of CMOS technology. The MM74 prefix typically denotes commercial grade devices in this product line.

Inverter Gates Replacement Considerations

Cross-reference with MC74HCT04ADG or MM74HCT04MTCX for alternative packaging options such as SOIC or TSSOP. Verify that substitute parts maintain the same HCT logic family specifications and pin configuration before implementation.