MM908E622ACPEK

MM908E622ACPEK

$9.15
  • Description:MM908E622 - Integrated motor dri
  • Series:908E622

SKU:fdcff18538c9 Category: Brand:

  
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Product Detailed Parameters

  • Description:MM908E622 - Integrated motor dri
  • Series:908E622
  • Mfr:NXP Semiconductors
  • Package:Bulk
  • Applications:-
  • Core Processor:-
  • Program Memory Type:FLASH (16kB)
  • Controller Series:908E
  • RAM Size:512 x 8
  • Interface:-
  • Number of I/O:12
  • Voltage - Supply:16V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:54-SSOP (0.295", 7.50mm Width) Exposed Pad
  • Supplier Device Package:54-SOIC-EP
  • Grade:Automotive
  • Qualification:-

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MM908E622ACPEK

Overview

The MM908E622ACPEK is an integrated automotive microcontroller and analog power driver designed for high-end mirror applications. It combines a Freescale HC08 M68HC908EY16 core with 16 KB flash and 512 B RAM, alongside a SMARTMOS analog die. The device features four half-bridge outputs (HB3/HB4: typ 275 mΩ; HB1/HB2: typ 750 mΩ), three high-side switches (HS1: typ 185 mΩ; HS2/HS3: typ 440 mΩ), and an electrochrome glass driver. It includes a LIN physical layer, Hall-effect sensor input, and operates within a -40°C to 85°C ambient temperature range in a 54-pin SOICW-EP package.

Feature Summary

  • Integrated HC08 MCU with 16 KB Flash, 512 B RAM, and LIN Physical Layer
  • Four Half-Bridge Outputs with diagnostic functions and low RDS(ON)
  • Three High-Side Switches and dedicated Electrochrome Glass Driver circuitry
  • Built-in Voltage Regulator providing 5.0 V supply for the embedded MCU

Applications

  • Automotive high-end mirror control systems
  • EC (Electrochrome) glass dimming and actuation
  • DC motor and actuator control in automotive environments

Procurement Notes

Verify the specific ordering suffix 'EK' corresponds to the 54-pin SOICW-EP package configuration. Confirm that the AC suffix aligns with the required industrial temperature range of -40°C to 85°C. Ensure application schematics account for the exposed pad thermal connection requirements specified in the datasheet.

Selection Notes

Select this component when a combined MCU and power stage solution is required for mirror actuators. The HB3 and HB4 outputs offer lower on-resistance compared to HB1 and HB2, suitable for higher current loads. Verify compatibility with the vehicle's LIN bus voltage levels and ensure sufficient decoupling capacitors are placed near the VSUP and VDD pins.

Part Context

This part belongs to the MM908E62x family of integrated smart power devices from NXP/Freescale. It is specifically engineered to reduce PCB footprint by integrating the microcontroller, power MOSFETs, and communication interfaces into a single package, replacing discrete MCU and driver combinations in legacy designs.

Replacement Considerations

The MM908E626AVPEKR2 is a related variant offering similar integration but with different pinout or output configurations. Verify pin-to-pin compatibility and software register mapping before substitution, as the MM908E622 is optimized specifically for EC glass and mirror applications.

MM908E622ACPEKMM908E622ACPEK
$9.15
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