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MMDL301T1G is listed in the RF Diode range at ChipApex. The manufacturer field lists onsemi. Its product description is DIODE SCHOTTKY 30V 200MW SOD323. Review the specifications below when checking this part for your BOM.
The MMDL301T1G is a single silicon Schottky barrier diode manufactured by onsemi, designed for high-efficiency detection and fast switching applications. It operates within a repetitive reverse voltage range of up to 30 V and supports a forward current of 10 mA. The device exhibits a maximum forward voltage drop of 600 mV and a low reverse leakage current of 200 nA. With a power dissipation rating of 200 mW, it functions reliably across an extended temperature range from -55 °C to +150 °C. The component is housed in a compact SOD-323-2 surface-mount package, facilitating automated assembly and space-constrained circuit designs.
Verify the specific ordering suffix against official onsemi documentation to confirm package type and tape-and-reel specifications. Ensure compliance with RoHS directives as indicated in the manufacturer's environmental declarations. Cross-reference the part number with authorized distributors to validate authenticity and traceability before procurement.
Select this component when a low-capacitance Schottky diode is required for high-frequency detection or switching tasks. The SOD-323-2 footprint suits dense PCB layouts. Confirm that the 10 mA forward current and 30 V reverse voltage ratings align with the circuit's operational limits and thermal management requirements.
This device belongs to the MBD301 family of silicon hot-carrier diodes produced by onsemi. The series includes variants such as MMBD301LT1G and MBD301G, offering similar electrical characteristics in different packaging options like SOT-23 and TO-92. These components are engineered for low-cost, high-volume manufacturing in consumer electronics and commercial applications.
Publicly documented substitutes within the same family include MMBD301LT1G (SOT-23 package) and MBD301G (TO-92 package). Verify pinout compatibility and physical dimensions when transitioning between these package types. No other cross-brand equivalents are confirmed in the provided source material.
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