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MOC215R1M is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is OPTOISO 2.5KV TRANS W/BASE 8SOIC. Review the specifications below when checking this part for your BOM.
The MOC215R1M is a single-channel transistor output optocoupler manufactured by Fairchild Semiconductor. It features an infrared emitting diode coupled to an NPN phototransistor with a base lead for enhanced switching speed and sensitivity. The device provides electrical isolation between input and output circuits, rated at 2500 Vrms. It is housed in an 8-pin SOIC surface-mount package designed for compact circuit board layouts.
Verify the manufacturer marking and date code against official Fairchild or ON Semiconductor documentation to ensure authenticity. Confirm that the component meets current RoHS compliance standards as specified in the latest datasheet revision. Check for any specific handling requirements related to electrostatic discharge during storage and installation.
Select this component when high-speed switching is required compared to standard phototransistor optocouplers due to the presence of the base pin. Ensure the isolation voltage rating of 2500 Vrms meets the safety requirements of the target application. Verify that the SOIC-8 package dimensions are compatible with the printed circuit board footprint design.
This part belongs to the MOC21x series of small outline surface mount phototransistor optocouplers from Fairchild Semiconductor. The series is characterized by its compact plastic packaging and reliable performance in isolating low-power control signals from higher-power loads. It serves as a bridge between microcontroller logic levels and external circuitry.
Check for direct replacements such as the MOC213R1M or MOC217R2M from ON Semiconductor or Fairchild, ensuring pinout compatibility and identical isolation ratings. Verify that substitute components maintain the same CTR (Current Transfer Ratio) specifications and package type to avoid redesigning the host circuit.
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