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MOCD207M_F132 is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists onsemi. Its product description is OPTOISO 2.5KV 2CH TRANS 8-SOIC. Review the specifications below when checking this part for your BOM.
The MOCD207M_F132 is a dual-channel transistor output optocoupler from onsemi, housed in an 8-SOIC surface-mount package. It provides 2500 Vrms isolation voltage between input and output circuits. The device features NPN phototransistor outputs with a typical rise time of 1.6μs and fall time of 2.2μs. Operating temperature range spans from -40°C to 100°C. Maximum forward current is 60mA, with a maximum forward voltage of 1.55V. Current transfer ratio ranges from 100% to 200%. This component is designed for DC input applications requiring high-voltage isolation.
Verify the specific F132 suffix against official datasheets to confirm packaging and reel specifications. Confirm RoHS compliance status through manufacturer declarations. Check for obsolescence notices as this part may have limited availability. Ensure ESD handling procedures are followed during assembly. Validate pinout compatibility with target PCB footprint before procurement.
Select this component when dual-channel isolation is required in space-constrained designs. Consider the 8-SOIC package dimensions for board layout constraints. Evaluate the 2500 Vrms isolation rating against system safety requirements. Assess the NPN output type compatibility with downstream logic circuits. Verify operating temperature range meets environmental conditions.
This device belongs to onsemi's MOCD series of optocouplers, which are widely used in industrial and consumer applications. The MOCD207M variant specifically offers dual-channel functionality in a standard SOIC-8 package. It serves as a cost-effective solution for basic isolation needs where high-speed performance is not critical.
MOCD207VM is a parameter-equivalent alternative available from onsemi. Cross-reference pinouts and electrical characteristics before substitution. Verify package compatibility and thermal performance similarities.
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