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MOCD213VM is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists onsemi. Its product description is OPTOISO 2.5KV 2CH TRANS 8-SOIC. Review the specifications below when checking this part for your BOM.
The MOCD213VM is a dual-channel phototransistor output optocoupler manufactured by onsemi. It features an NPN phototransistor output configuration housed in an 8-pin SOIC-Narrow package. The device provides electrical isolation with a rated insulation voltage of 2500 Vrms. Key electrical parameters include a maximum collector-emitter voltage of 70 V, a maximum collector current of 150 mA, and a forward voltage of 1.5 V at a forward current of 60 mA. The typical rise time is 3.2 µs and the fall time is 4.7 µs. It operates within a temperature range of -40°C to +100°C.
Verify the specific suffix 'VM' against the manufacturer's official datasheet to confirm the exact tape-and-reel packaging specifications and binning requirements. Ensure that the ordering information matches the precise component marking and date code standards defined by onsemi for this variant. Cross-reference the part number with authorized distributor catalogs to validate authenticity and traceability before finalizing procurement orders.
Select the MOCD213VM when dual-channel isolation is required within a compact surface-mount footprint. Consider its 70 V collector-emitter voltage rating and 150 mA current capability for driving standard logic loads. Evaluate the 2500 Vrms insulation rating against system safety requirements. Compare the 3.2 µs rise time performance against application timing constraints to ensure adequate switching speed for the intended digital communication protocols.
This component belongs to the MOCD series of phototransistor output optocouplers from onsemi. The series is designed for general-purpose isolation applications requiring reliable signal transmission across isolated barriers. The MOCD213VM specifically utilizes the SOIC-Narrow package to facilitate automated assembly processes while maintaining high-density PCB layout capabilities common in modern electronic designs.
Public confirmed substitute part numbers are not available in the provided documentation.
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