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Product Detailed Parameters
- Description:IC MPU MPC6XX 266MHZ 255FCCBGA
- Series:MPC6xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC 603e
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:-
- RAM Controllers:-
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:255-BCBGA, FCCBGA
- Supplier Device Package:255-FCCBGA (21x21)
- Additional Interfaces:-
- Grade:-
- Qualification:-
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Overview
The MPC603RRX266TC is a PowerPC 603e RISC microprocessor implementing the PID7t-603e process. It features a 32-bit architecture with a maximum core frequency of 266 MHz. The device utilizes a 255-pin ceramic ball grid array (CBGA) package. Electrical specifications require a core supply voltage (Vdd/AVdd) of 2.5 ± 5% V dc and an I/O supply voltage (OVdd) of 3.3 ± 5% V dc. The processor supports a selectable 32- or 64-bit external data bus and a 32-bit address bus.
Feature Summary
- Superscalar execution capability issuing up to three instructions per clock cycle
- Integrated 16-Kbyte instruction and data caches with MMU support
- Five independent execution units including integer, floating-point, and branch processing
- Support for multiple software-controllable low-power modes
Applications
- Embedded systems requiring high-performance RISC processing
- Industrial control applications utilizing PowerPC architecture
- Telecommunications equipment designs
- Network infrastructure components
Procurement Notes
Verify the specific ordering suffix against official NXP documentation to confirm speed bin and package type. Ensure power supply rails match the required 2.5 V core and 3.3 V I/O specifications. Confirm thermal management requirements align with the specified junction-to-case thermal resistance values for the CBGA package.
Selection Notes
Select this component for designs requiring a 266 MHz superscalar processor within the PowerPC family. Consider the CBGA package constraints regarding board space and thermal dissipation. Evaluate system memory latency and bus width compatibility with the 32/64-bit external interface options available on this implementation.
Part Context
This part belongs to the PowerPC 603e microprocessor family manufactured by Freescale Semiconductor, now NXP. The PID7t designation indicates a 0.29 µm CMOS process technology. This specific model represents one of the speed grades offered for the 603e architecture in ceramic packaging.
Replacement Considerations
The PBGA variant of the same speed grade serves as a pin-compatible drop-in replacement, though it is limited to lower speeds. Other PID7t-603e implementations may differ in voltage requirements or fabrication process.
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