— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC7XX 300MHZ 360CBGA
- Series:MPC7xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:300MHz
- Co-Processors/DSP:-
- RAM Controllers:-
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:2.5V, 3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:360-BCBGA, FCCBGA
- Supplier Device Package:360-CBGA (25x25)
- Additional Interfaces:-
- Grade:-
- Qualification:-
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Overview
The MPC755BRX300LE is a PowerPC-based RISC microprocessor manufactured by NXP Semiconductors. It implements the e600 core architecture with a single processing core and a 32-bit data bus width. The device operates at a maximum clock frequency of 300 MHz and utilizes a CBGA-360 package for surface mount installation. It features an internal L2 cache interface supporting up to 1 MB, alongside 32 kB instruction and 32 kB data L1 caches. The processor supports fixed and floating-point instructions, operates on a 2 V supply voltage, and functions within a temperature range of 0°C to +105°C.
Feature Summary
- Implements the PowerPC instruction set architecture with out-of-order execution capabilities
- Integrates an internal Level 2 cache controller with dedicated external SRAM interface
- Supports comprehensive power management modes including doze, nap, and sleep states
- Includes integrated thermal management assist unit with on-chip sensor
Applications
- Low-cost embedded systems requiring reduced instruction set computing
- Power management intensive applications utilizing dynamic power scaling
- Systems requiring high-performance integer and floating-point arithmetic operations
Procurement Notes
Verify component authenticity through official manufacturer channels or authorized distributors. Confirm that the specific part number matches the required speed grade and package type. Ensure compliance with RoHS directives if applicable to your region. Check for any available errata documents relevant to this hardware revision before finalizing procurement decisions.
Selection Notes
Select this component when designing systems based on the PowerPC architecture requiring moderate processing speeds. Consider the CBGA package constraints during PCB layout planning. Evaluate thermal dissipation requirements against the specified junction-to-ambient resistance values. Ensure the system design accommodates the specific voltage levels for core and I/O supplies.
Part Context
This microprocessor belongs to the MPC755 family, which shares architectural similarities with the MPC745 series. The primary distinction lies in the inclusion of an internal L2 cache controller in the MPC755 variant. These devices are designed for low-power applications and utilize 0.22 µm CMOS technology. The family targets cost-sensitive markets while maintaining high computational throughput.
Replacement Considerations
Consult official documentation for recommended upgrades as these parts may be discontinued. Contact sales offices for current replacement options.
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