— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC82XX 300MHZ 352TBGA
- Series:MPC82xx
- Mfr:Freescale Semiconductor
- Package:Bulk
- Core Processor:PowerPC 603e
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:300MHz
- Co-Processors/DSP:-
- RAM Controllers:SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:352-LBGA
- Supplier Device Package:352-TBGA (35x35)
- Additional Interfaces:I2C, I²O, PCI, UART
Download product information
Overview
The MPC8245TVV300D is a microprocessor based on the PowerPC 603e core, operating at a maximum clock frequency of 300 MHz. It features a 32-bit data bus and utilizes a 352-TBGA package with dimensions of 35x35 mm. The device supports an I/O voltage of 3.3 V and operates within a temperature range of -40°C to +105°C. It includes 16 kB instruction cache and 16 kB data cache for L1 storage.
Feature Summary
- Integrates a high-performance PowerPC 603e superscalar processor core with floating-point capabilities.
- Provides a 32-bit PCI interface supporting up to 66 MHz operation rates.
- Includes a memory controller capable of supporting SDRAM up to 133 MHz.
- Features dual-channel DMA controllers that can be cascaded together.
Applications
- Network infrastructure systems
- Telecommunications equipment
- Router and switch implementations
- Network storage applications
Procurement Notes
Verify component authenticity through authorized NXP Semiconductors channels due to end-of-life status. Confirm package integrity and moisture sensitivity level handling procedures before assembly. Ensure compatibility with existing PCB footprints and thermal management designs. Validate electrical specifications against system requirements prior to integration.
Selection Notes
Select this component for embedded applications requiring integrated PCI connectivity and high processing performance. Consider the 352-TBGA package constraints for board layout. Evaluate power consumption and thermal dissipation needs given the operating voltage and frequency. Ensure software support aligns with the Power Architecture standard.
Part Context
This part belongs to the MPC82xx series of integrated host processors designed for cost-sensitive and space-constrained environments. It combines a powerful processor core with essential peripherals like PCI and memory controllers to reduce system component count. The series targets network infrastructure and telecommunications markets.
Replacement Considerations
Publicly confirmed substitute part numbers are not available in the provided documentation. Verify cross-references with NXP Semiconductors directly for any updated or compatible components within the MPC82xx family.
ChipApex | Global Electronic Components Supplier








