— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC82XX 400MHZ PBGA516
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray,Tray
- Core Processor:PowerPC G2_LE
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:400MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (2)
- SATA:-
- USB:USB 2.0 (1)
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:516-BBGA
- Supplier Device Package:516-PBGA (27x27)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
Download product information
Overview
The MPC8247CZQTIEA is a PowerQUICC II family microprocessor featuring a single 32-bit G2_LE core operating at 400 MHz. It utilizes a 516-pin PBGA package with lead spheres and supports an extended temperature range of -40°C to +105°C. The device integrates a Communications Processor Module (CPM), PCI bridge, USB 2.0 controller, and dual Ethernet ports. Core voltage ranges from 1.425 V to 2.25 V, while I/O operates at 3.3 V.
Feature Summary
- Integrates a dual-issue G2_LE processor core with separate 16 KB instruction and data caches.
- Includes a modified Communications Processor Module (CPM) for flexible peripheral support.
- Features a 60x-to-PCI bridge supporting up to 66 MHz operation.
- Provides integrated USB 2.0 full/low rate controller and dual 10/100 Mbps Ethernet interfaces.
Applications
- Enterprise networking infrastructure
- Telecom transmission and switching systems
- Storage area network controllers
Procurement Notes
Verify the specific ZQ package variant containing lead spheres against environmental compliance requirements. Confirm the 400 MHz speed grade matches system timing constraints. Check for end-of-life status as distribution may be limited. Ensure supply chain sources provide valid traceability documentation.
Selection Notes
Select this component when high-performance embedded communications processing is required alongside PCI connectivity. The ZQ package offers specific mechanical characteristics compared to VR variants. Verify that the 3.3 V I/O levels are compatible with target peripherals without level shifting.
Part Context
This part belongs to the NXP MPC82xx series, specifically the MPC8247 model within the PowerQUICC II family. It shares architectural similarities with the MPC8272 but lacks the integrated Security Engine found in higher-end models. The ZQ suffix denotes the specific ball grid array packaging configuration.
Replacement Considerations
Direct replacements include MPC8247VRPIEA or MPC8247CVRPIEA. Note that VR packages use lead-free pins rather than lead spheres. Speed grades vary; ensure the replacement supports the required 400 MHz frequency.
ChipApex | Global Electronic Components Supplier







