MPC8250AVVPIBC

MPC8250AVVPIBC

$167.65
  • Description:IC MPU MPC82XX 300MHZ 480TBGA
  • Series:MPC82xx
  • Mfr:NXP USA Inc.
  • Package:Tray,Tray

SKU:a3a08496fa54 Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MPU MPC82XX 300MHZ 480TBGA
  • Series:MPC82xx
  • Mfr:NXP USA Inc.
  • Package:Tray,Tray
  • Core Processor:PowerPC G2
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:300MHz
  • Co-Processors/DSP:Communications; RISC CPM
  • RAM Controllers:DRAM, SDRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:10/100Mbps (3)
  • SATA:-
  • USB:-
  • Voltage - I/O:3.3V
  • Operating Temperature:0°C ~ 105°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:480-LBGA Exposed Pad
  • Supplier Device Package:480-TBGA (37.5x37.5)
  • Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
  • Grade:-
  • Qualification:-

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MPC8250AVVPIBC

Overview

The MPC8250AVVPIBC is a PowerQUICC II communications processor based on the G2 core. It features a dual-issue integer core supporting frequencies up to 200 MHz and an integrated Communications Processor Module (CPM). The device includes separate 16-Kbyte data and instruction caches, a floating-point unit, and a 64-bit 60x bus interface. Connectivity options include a PCI bridge, local bus, and multiple serial controllers such as FCCs, SCCs, SMCs, SPI, and I2C. It utilizes a 516-pin PBGA package with separate 1.8 V core and 3.3 V I/O power supplies.

Feature Summary

  • Integrated dual-issue EC603e microprocessor core with floating-point unit
  • Embedded 32-bit RISC Communications Processor Module for protocol offloading
  • Programmable 60x-to-PCI bridge supporting host or agent modes
  • Dedicated memory controller with glueless interface to SRAM, DRAM, and Flash

Applications

  • Enterprise networking equipment
  • Telecom transmission and switching systems
  • Wired and wireless infrastructure communications processing
  • High-end communications and networking routers

Procurement Notes

Verify the specific suffix AVVPIBC against official NXP documentation to confirm package type, temperature range, and speed grade. Confirm RoHS compliance status and check for End-of-Life notifications prior to procurement. Ensure design compatibility with the 516-pin PBGA footprint and required voltage levels.

Selection Notes

Select this component for applications requiring high-performance control plane processing combined with extensive layer 2 communications functionality. Consider the separate PLLs for the G2 core and CPM if independent frequency optimization is required. Evaluate thermal management needs given the power dissipation characteristics at maximum operating frequencies.

Part Context

This part belongs to the MPC82xx series of PowerQUICC II processors designed by NXP Semiconductors. These devices are built on Power Architecture technology and are intended for communications infrastructure markets. The MPC8250 variant specifically targets applications needing integrated Ethernet, HDLC, and TDM capabilities alongside a powerful embedded core.

Replacement Considerations

The MPC8250ACVRIHBC is a footprint-compatible alternative within the same family. Verify pinout and electrical specifications before substitution. Other members of the MPC82xx series may offer different peripheral counts or performance levels.

MPC8250AVVPIBCMPC8250AVVPIBC
$167.65
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