— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC82XX 200MHZ PBGA516
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:200MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:516-BBGA
- Supplier Device Package:516-PBGA (27x27)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8250AZQIHBC is a PowerQUICC II integrated communications processor based on the EC603e core. It operates at frequencies up to 200 MHz with a 1.8 V core supply and 3.3 V I/O supply. The device features a dual-issue integer core, separate 16-Kbyte instruction and data caches, and an embedded Communication Processor Module (CPM). It includes a 60x-to-PCI bridge supporting 66 MHz operation, a twelve-bank memory controller, and multiple serial interfaces including Ethernet, HDLC, and TDM.
Feature Summary
- Dual-issue EC603e microprocessor core with floating-point unit
- Integrated Communication Processor Module for flexible protocol support
- 60x-to-PCI bridge with DMA capabilities
- Twelve-bank memory controller with glueless interface
Applications
- High-performance network infrastructure equipment
- Telecommunications base stations
- Industrial control systems requiring real-time processing
- Embedded communication gateways
Procurement Notes
Verify the specific suffix AZQI against official NXP documentation to confirm package type and temperature range. Confirm RoHS compliance status as manufacturing processes evolve. Check for obsolescence notices or lifecycle changes directly from the manufacturer before procurement planning.
Selection Notes
Select this component when high-speed packet processing and dedicated hardware protocol handling are required. The integrated CPM offloads CPU tasks, optimizing performance for networking applications. Ensure system design supports the required 1.8 V and 3.3 V power domains and thermal dissipation for the chosen operating frequency.
Part Context
This part belongs to the PowerQUICC II family of integrated communications processors. It is designed for demanding embedded applications requiring robust connectivity and processing power. The MPC8250 provides a footprint-compatible solution within its series, facilitating design upgrades and platform standardization across different product generations.
Replacement Considerations
Consult official substitution guides for compatible alternatives. Verify electrical and pinout compatibility if considering cross-family replacements.
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