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Product Detailed Parameters
- Description:IC MPU MPC82XX 300MHZ 480TBGA
- Series:MPC82xx
- Mfr:Freescale Semiconductor
- Package:Bulk
- Core Processor:PowerPC G2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:300MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:-
- Voltage - I/O:3.3V
- Operating Temperature:0°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
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Overview
The MPC8260AZUPJDB is a PowerPC G2 microprocessor from the MPC82xx series, manufactured by NXP USA Inc. It features a single 32-bit core operating at 300MHz. The device is housed in a 480-TBGA package with dimensions of 37.5x37.5 mm. It supports I/O voltages of 3.3V and includes interfaces such as I2C, SCC, SMC, SPI, UART, and USART. The processor integrates a Communications Processor Module (CPM) and controllers for DRAM and SDRAM.
Feature Summary
- Integrates a PowerPC G2 core with a dedicated Communications Processor Module for efficient data handling.
- Supports multiple serial communication protocols including I2C, SPI, UART, and USART.
- Features integrated memory controllers compatible with DRAM and SDRAM technologies.
Applications
- Wireless infrastructure systems
- Packet telephony equipment
- WAN switching and transmission devices
Procurement Notes
Verify component authenticity through authorized channels due to end-of-life status. Confirm RoHS compliance requirements against specific project constraints, as this variant may not meet current environmental standards. Validate package integrity upon receipt to ensure suitability for surface mount assembly processes.
Selection Notes
Select this component for applications requiring high-speed serial processing within embedded networking environments. Ensure system design accommodates the 3.3V I/O voltage levels and the specific thermal characteristics of the TBGA package. Evaluate compatibility with existing DRAM/SDRAM memory architectures before integration.
Part Context
This part belongs to the MPC82xx family of PowerQUICC II processors. These devices are designed for communications applications, offering a balance of processing power and specialized peripheral support. The MPC8260 variant specifically targets high-performance networking tasks.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation. Consider evaluating other MPC82xx variants or newer generations from NXP for long-term supply stability.
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