— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC82XX 333MHZ 480TBGA
- Series:MPC82xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC G2_LE
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:333MHz
- Co-Processors/DSP:Communications; RISC CPM
- RAM Controllers:DRAM, SDRAM
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100Mbps (3)
- SATA:-
- USB:USB 2.0 (1)
- Voltage - I/O:3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:480-LBGA Exposed Pad
- Supplier Device Package:480-TBGA (37.5x37.5)
- Additional Interfaces:I2C, SCC, SMC, SPI, UART, USART
- Grade:-
- Qualification:-
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Overview
The MPC8270CZUQLDA is a PowerQUICC II integrated communications processor utilizing the G2_LE core. It features a 32-bit architecture with 16 KB instruction and data caches. The device supports bus frequencies up to 100 MHz and CPU speeds up to 450 MHz. It includes three Fast Communication Controllers (FCCs), four Serial Communications Controllers (SCCs), two Multi-Channel Controllers (MCCs), and a PCI bridge. The component operates within a core voltage range of 1.45 V to 1.60 V and an I/O voltage range of 3.135 V to 3.465 V, housed in a 480-pin TBGA package.
Feature Summary
- Integrated dual-issue G2_LE core with floating-point unit and separate power supplies for logic and I/O.
- Communications Processor Module (CPM) supporting Ethernet, ATM, HDLC, and USB 2.0 protocols.
- Programmable PCI host bridge and agent supporting hot-swap specifications.
- Glueless memory controller interface supporting SRAM, SDRAM, DRAM, and Flash.
Applications
- Wired and wireless infrastructure communications processing
- High-end routers and DSLAMs
- Telecom switching equipment
- Cellular base stations
Procurement Notes
Verify the specific ordering suffix against the manufacturer's current documentation to confirm package type and lead content. Confirm that the intended application environment falls within the specified ambient temperature and voltage operating conditions. Ensure proper thermal management is implemented as per the junction-to-ambient resistance values provided in the datasheet.
Selection Notes
Select this component for applications requiring high-performance layer 2 forwarding and control plane processing. Consider the available package options if different pin counts or lead types are required. Evaluate the clock configuration modes to ensure the desired CPU and CPM frequency ratios meet system timing requirements.
Part Context
This part belongs to the MPC8280 family of PowerQUICC II processors manufactured by NXP Semiconductors (formerly Freescale). The family utilizes HiPerMOS7 0.13-micron process technology. Other members include the MPC8275 and MPC8280, which offer varying levels of peripheral integration such as additional UTOPIA ports or Transmission Convergence layers.
Replacement Considerations
Consult the official datasheet for alternative devices within the MPC82xx family. Verify software compatibility and pinout differences before substituting with other variants like the MPC8275 or MPC8280.
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