— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC83XX 266MHZ 620HBGA
- Series:MPC83xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC e300
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:266MHz
- Co-Processors/DSP:-
- RAM Controllers:DDR, DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (3)
- SATA:-
- USB:USB 2.0 + PHY (2)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:-40°C ~ 105°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:620-BBGA Exposed Pad
- Supplier Device Package:620-HBGA (29x29)
- Additional Interfaces:DUART, I2C, PCI, SPI
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Overview
The MPC8343CZQADD is a PowerQUICC II Pro integrated host processor based on the e300 core, operating at up to 400 MHz. It features dual three-speed Ethernet controllers (10/100/1000 Mbps), dual PCI interfaces, and dual USB 2.0 controllers. The device includes a DDR1/DDR2 SDRAM controller with ECC support and an integrated security engine for hardware-accelerated encryption algorithms.
Feature Summary
- Integrated high-performance superscalar processor core with lockable L1 cache
- Dual gigabit Ethernet controllers supporting multiple physical interface standards
- Hardware-accelerated security engine supporting public key and symmetric encryption
- Dual role USB controller compatible with USB 2.0 specifications
Applications
- Ethernet routers and switches
- Wireless LAN devices
- Network storage systems
- Industrial control equipment
Procurement Notes
Verify silicon revision compatibility; this document covers revision 3.x silicon and later. Confirm package type matches the 672-pin TBGA requirement. Ensure power sequencing adheres to specified voltage ramp-up guidelines to prevent excessive current draw during initialization.
Selection Notes
Select this component for applications requiring high integration of networking and security functions. Verify that the system design supports the required 1.2 V core voltage and appropriate I/O voltages. Consider thermal dissipation requirements as power consumption varies with clock frequency and bus utilization.
Part Context
This part belongs to the PowerQUICC II Pro family, which upgrades the previous PowerQUICC II series. It utilizes the e300 SoC platform, offering enhanced performance over the older 603e core while maintaining software compatibility. The architecture is designed for cost-effective embedded networking solutions.
Replacement Considerations
MPC8349E: Higher performance variant within the same family.
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