— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:IC MPU MPC85XX 800MHZ 783FCPBGA
- Series:MPC85xx
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:PowerPC e500v2
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:800MHz
- Co-Processors/DSP:Security; SEC
- RAM Controllers:DDR, DDR2
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:-
- USB:-
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:0°C ~ 90°C (TA)
- Security Features:Cryptography, Random Number Generator
- Mounting Type:Surface Mount
- Package / Case:783-BBGA, FCBGA
- Supplier Device Package:783-FCPBGA (29x29)
- Additional Interfaces:DUART, HSSI, I2C, PCI
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Overview
The MPC8533EVTANGA is a PowerQUICC III integrated processor featuring an e500 core with speeds up to 1.0 GHz, delivering 2,240 MIPS at peak frequency. It includes a 256-Kbyte L2 cache/SRAM, dual enhanced three-speed Ethernet controllers (eTSECs), and three PCI Express interfaces (two x4, one x1). The device integrates a security engine supporting DES, AES, RSA, and other algorithms, alongside DDR/DDR2 memory controllers with ECC support. Operating conditions range from 0°C to 90°C junction temperature.
Feature Summary
- Integrated security engine for hardware-accelerated encryption and authentication
- Dual high-performance Ethernet controllers with TCP/IP acceleration
- Flexible L2 cache configurable as SRAM or cache with full ECC support
- Multiple high-speed interconnects including PCI Express and PCI
Applications
- Enterprise networking equipment
- Industrial control systems
- Building energy management controllers
- Advanced multifunction printers
Procurement Notes
Verify the specific suffix VTANGA against official NXP documentation to confirm package type, speed grade, and RoHS compliance status. Confirm current product lifecycle status as this component family may be discontinued. Ensure power sequencing requirements for VDD and GVDD are strictly followed during design validation.
Selection Notes
Select this processor for applications requiring high integration of networking and security features within a single SoC. Evaluate thermal performance at maximum operating frequencies, as power dissipation increases significantly at higher clock speeds. Ensure the system design supports the required 783-pin FC-PBGA package dimensions and pinout compatibility.
Part Context
This component belongs to the Freescale/NXP PowerQUICC III family, designed for communication and embedded processing tasks. It utilizes Power Architecture technology and is built on a 90 nm SOI process. The MPC8533E variant specifically targets cost-sensitive yet high-performance applications compared to higher-end models in the series.
Replacement Considerations
Consult official NXP documentation for confirmed substitute part numbers. Verify functional equivalence regarding pinout, voltage levels, and software compatibility before substitution.
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