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Product Detailed Parameters
- Description:IC MPU MPC85XX 1.333GHZ 783BGA
- Series:MPC85xx
- Mfr:Freescale Semiconductor
- Package:Tray
- Core Processor:PowerPC e500
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:1.333GHz
- Co-Processors/DSP:-
- RAM Controllers:DDR2, DDR3
- Graphics Acceleration:No
- Display & Interface Controllers:-
- Ethernet:10/100/1000Mbps (2)
- SATA:SATA 3Gbps (2)
- USB:USB 2.0 (3)
- Voltage - I/O:1.8V, 2.5V, 3.3V
- Operating Temperature:0°C ~ 90°C (TA)
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:783-BBGA, FCBGA
- Supplier Device Package:783-FCPBGA (29x29)
- Additional Interfaces:DUART, I2C, MMC/SD, PCI, SPI
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Overview
The MPC8536AVTAULA is a PowerQUICC III microprocessor featuring a single-core 32-bit e500 processor running at 1.333 GHz. It utilizes a 783-ball FC-PBGA package and operates within a commercial temperature range of 0°C to 90°C. The device integrates 32 KB L1 instruction and data caches alongside a 512 KB L2 cache. It supports DDR2/DDR3 memory with ECC, dual Gigabit Ethernet controllers, PCIe, SATA, USB, SDHC, and various serial interfaces.
Feature Summary
- Integrates a high-performance 32-bit e500 core with double-precision floating-point capabilities
- Includes an embedded security engine for hardware-accelerated cryptographic processing
- Features dual enhanced three-speed Ethernet controllers (eTSECs) for network connectivity
- Supports multiple peripheral standards including PCI Express, Serial ATA, and USB
Applications
- Broadband gateway infrastructure
- Wireless base station equipment
- Industrial control systems
- Network storage appliances
Procurement Notes
Verify component authenticity through authorized NXP channels due to end-of-life status. Confirm package integrity and moisture sensitivity level handling procedures before assembly. Review the latest errata documents for known silicon revisions and operational constraints specific to this part number prior to final design implementation.
Selection Notes
Select this model for applications requiring robust networking features combined with hardware security acceleration. Ensure system design accommodates the 783-ball BGA footprint and thermal requirements for the specified operating temperature range. Verify compatibility with required DDR2 or DDR3 memory configurations and interface voltage levels.
Part Context
This component belongs to the Freescale Semiconductor MPC85xx family, specifically the PowerQUICC III series. It represents a System-on-Chip solution designed for communication infrastructure. The device combines processing power with integrated peripherals to reduce board space and complexity in networking and industrial applications.
Replacement Considerations
Consult official NXP documentation for qualified pin-to-pin or functional replacements. Evaluate newer generations within the QorIQ or Power Architecture portfolios for long-term supply availability and performance upgrades.
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