MPC860DTCZQ50D4

MPC860DTCZQ50D4

  • Description:IC MPU MPC8XX 50MHZ 357BGA
  • Series:MPC8xx
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:38e5e0aee5df Category: Brand:

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Product Detailed Parameters

  • Description:IC MPU MPC8XX 50MHZ 357BGA
  • Series:MPC8xx
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:MPC8xx
  • Number of Cores/Bus Width:1 Core, 32-Bit
  • Speed:50MHz
  • Co-Processors/DSP:Communications; CPM
  • RAM Controllers:DRAM
  • Graphics Acceleration:No
  • Display & Interface Controllers:-
  • Ethernet:10Mbps (2), 10/100Mbps (1)
  • SATA:-
  • USB:-
  • Voltage - I/O:3.3V
  • Operating Temperature:-40°C ~ 95°C (TA)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:357-BBGA
  • Supplier Device Package:357-PBGA (25x25)
  • Additional Interfaces:HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART

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MPC860DTCZQ50D4

Overview

The MPC860DTCZQ50D4 is a microprocessor IC from the MPC86xx family, manufactured by NXP Semiconductors. It features a single 32-bit Power Architecture core operating at 50 MHz. The device is housed in a 357-pin PBGA package measuring 25x25 mm. It includes 4 KB instruction cache and 4 KB data cache. The processor supports Ethernet interfaces with speeds of 10 Mbps and 10/100 Mbps. Operating voltage for I/O is 3.3 V, and the junction temperature range is -40°C to 95°C.

Feature Summary

  • Integrates a 32-bit Power Architecture core with MMUs and caches
  • Includes Communications Processor Module (CPM) with serial controllers
  • Supports ATM and Ethernet networking protocols
  • Features PCMCIA interface and low-power modes

Applications

  • Communications controller applications
  • Networking systems
  • Telecommunications equipment

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm part number accuracy against official datasheets. Check for obsolescence status as this model may be discontinued. Ensure environmental compliance documentation matches project requirements. Validate packaging specifications for surface mount assembly compatibility.

Selection Notes

Select this component for designs requiring integrated communications processing capabilities. Consider the specific cache sizes and peripheral sets available in the MPC860 variant. Evaluate thermal management requirements based on the BGA package type. Verify software toolchain support for the PowerQUICC architecture before finalizing the design choice.

Part Context

This part belongs to the MPC860 PowerQUICC family, which provides an integrated processor and peripheral solution. The family is designed for controller applications, particularly in communications and networking. The MPC860 implements Power Architecture technology and enhances the QUICC architecture with additional features like I2C and improved memory controllers.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.

MPC860DTCZQ50D4MPC860DTCZQ50D4

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