MSC2X50SDA070J

MSC2X50SDA070J

$40.60
  • Description:DIODE MODULE SIC 700V 50A SOT227
  • Series:-

SKU:d575df787a82 Category: Brand:

  
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Product Detailed Parameters

  • Description:DIODE MODULE SIC 700V 50A SOT227
  • Series:-
  • Mfr:Microchip Technology
  • Package:Tube
  • Diode Configuration:2 Independent
  • Technology:SiC (Silicon Carbide) Schottky
  • Voltage - DC Reverse (Vr) (Max):700 V
  • Current - Average Rectified (Io) (per Diode):50A (DC)
  • Voltage - Forward (Vf) (Max) @ If:1.8 V @ 50 A
  • Speed:No Recovery Time > 500mA (Io)
  • Reverse Recovery Time (trr):0 ns
  • Current - Reverse Leakage @ Vr:200 µA @ 700 V
  • Operating Temperature - Junction:-55°C ~ 175°C
  • Mounting Type:Chassis Mount
  • Package / Case:SOT-227-4, miniBLOC
  • Supplier Device Package:SOT-227 (ISOTOP®)
  • Grade:-
  • Qualification:-

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MSC2X50SDA070J

Overview

The MSC2X50SDA070J is a dual anti-parallel silicon carbide Schottky diode module manufactured by Microchip Technology. It features a 700 V reverse voltage rating and a 50 A forward current capacity. The device utilizes a SOT-227-4 package with screw mount installation, supporting an operating temperature range from -55°C to +175°C. The typical forward voltage drop is 1.8 V.

Feature Summary

  • Dual anti-parallel configuration for bridge rectifier applications
  • Silicon Carbide (SiC) technology for high thermal performance
  • Screw mount SOT-227-4 package design

Applications

  • Industrial motor drives
  • Uninterruptible power supplies (UPS)
  • High-frequency switching power converters

Procurement Notes

Verify the specific suffix 'J' against official Microchip documentation to confirm exact mechanical dimensions and terminal specifications. Confirm RoHS compliance status through the manufacturer's latest product change notices or datasheet revision history before finalizing procurement plans.

Selection Notes

Select this component when a compact dual-diode solution is required for high-voltage, high-current environments. The SiC material enables superior thermal conductivity compared to silicon alternatives. Ensure the PCB or heatsink mounting structure accommodates the SOT-227-4 footprint and screw torque requirements.

Part Context

This part belongs to Microchip's series of discrete and power modules utilizing silicon carbide technology. It serves as a robust alternative to traditional silicon diodes in applications demanding higher efficiency and thermal stability under extreme operating conditions.

Replacement Considerations

Consult official substitution guides for compatible single-die or alternative package configurations. Verify that any substitute maintains the 700 V rating, 50 A current handling, and SOT-227-4 mechanical interface.

MSC2X50SDA070JMSC2X50SDA070J
$40.60
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