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The MSCD165-18 is a glass passivated rectifier diode module from the MSxD165 series, rated for a maximum repetitive reverse voltage (VRRM) of 1800V. It provides an average forward current (IFAV) of 165A at a case temperature of 100°C and supports a non-repetitive surge current (IFSM) of 6000A. The module utilizes an aluminum oxide ceramic isolated metal baseplate for thermal management, featuring a junction-to-case thermal resistance of 0.18°C/W per diode. Electrical characteristics include a maximum forward voltage of 1.4V at 300A and a leakage current of ≤9mA.
Verify component authenticity by checking manufacturer markings against official datasheet specifications. Confirm package type D2 dimensions and terminal torque requirements (Mt 5±15% Nm, Ms 5±15% Nm). Ensure thermal interface material compatibility with the specified Rth(c-s) of 0.05°C/W. Validate that operating temperatures remain within the -40°C to 150°C junction range during deployment.
Select this module when high voltage isolation and robust surge handling are required in power conversion systems. The 1800V rating suits applications demanding significant reverse voltage margins. Consider the 165A continuous current capacity relative to cooling infrastructure capabilities. The single-phase or three-phase bridge configurations available in the series allow flexible circuit topology integration.
This component belongs to the MSxD165 family of glass passivated rectifier diode modules manufactured by Microsemi. The series encompasses variants with different voltage ratings ranging from 800V to 1800V, sharing identical current ratings and physical packaging. These modules are designed for industrial power electronics applications requiring reliable high-voltage rectification.
Direct substitutes within the same series include MSCD165-08, MSCD165-12, and MSCD165-16, which share identical mechanical and thermal characteristics but offer lower voltage ratings of 800V, 1200V, and 1600V respectively. Cross-series replacements require verification of pinout compatibility and thermal resistance values.