ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：DIODE MODULE SIC 700V 200A D1P
- Series：-
- Mfr：Microchip Technology
- Package：Box
- Diode Configuration：1 Pair Common Cathode
- Technology：SiC (Silicon Carbide) Schottky
- Voltage - DC Reverse (Vr) (Max)：700 V
- Current - Average Rectified (Io) (per Diode)：200A
- Voltage - Forward (Vf) (Max) @ If：1.8 V @ 200 A
- Speed：No Recovery Time > 500mA (Io)
- Reverse Recovery Time (trr)：0 ns
- Current - Reverse Leakage @ Vr：800 µA @ 700 V
- Operating Temperature - Junction：-40°C ~ 175°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：D1P
- Grade：-
- Qualification：-
Download product information
Overview
The MSCDC200KK70D1PAG is a Silicon Carbide (SiC) Schottky diode module manufactured by Microchip Technology. It features a dual common cathode configuration with a maximum repetitive reverse voltage of 700 V and a forward current rating of 200 A. The device exhibits a typical forward voltage of 1.5 V at rated conditions. It operates within a temperature range of -40 °C to +125 °C junction temperature. The component utilizes screw mount installation for secure chassis integration.
Feature Summary
- Utilizes Silicon Carbide (SiC) technology for high-temperature operation and low switching losses.
- Features a dual common cathode configuration suitable for bridge rectifier applications.
- Designed for robust thermal management in high-power density environments.
Applications
- High-efficiency AC/DC power supplies
- Induction heating systems
- Uninterruptible Power Supplies (UPS)
Procurement Notes
Verify the specific ordering suffix D1PA against the manufacturer's latest datasheet to confirm pinout and mechanical dimensions. Ensure that the screw mounting torque specifications are strictly adhered to during assembly to maintain electrical integrity and thermal performance. Confirm RoHS compliance status through official documentation prior to final procurement decisions.
Selection Notes
Select this module when high-frequency switching and elevated operating temperatures are required. The 700 V rating suits medium-voltage industrial applications. Compare the 200 A current capacity against system load requirements. Consider the thermal resistance characteristics relative to the available heatsink solution. Evaluate the package style compatibility with existing chassis designs.
Part Context
This component belongs to the Microchip PM-DIODE-SIC-SBD-D1P series of SiC Schottky diode modules. It represents a discrete power semiconductor solution designed to replace traditional silicon counterparts in demanding power conversion topologies. The series emphasizes reliability and efficiency in modern power electronics architectures.
Replacement Considerations
Consult official cross-reference guides for compatible alternatives. Verify that any substitute part matches the 700 V reverse voltage, 200 A forward current, and dual common cathode configuration. Ensure identical mounting style and thermal interface requirements are met before substitution.
