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Product Detailed Parameters
- Description：PM-IGBT-TFS-SP3F
- Series：MSC
- Mfr：Microchip Technology
- Package：Tube
- IGBT Type：Trench
- Configuration：Full Bridge
- Vce(on) (Max) @ Vge, Ic：-
- Input：Standard
- NTC Thermistor：Yes
- Operating Temperature：-
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：SP3F
- Voltage - Collector Emitter Breakdown (Max)：1200 V
- Current - Collector (Ic) (Max)：40 A
- Power - Max：-
- Current - Collector Cutoff (Max)：40 A
- Input Capacitance (Cies) @ Vce：-
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Overview
The MSCGL40X120T3AG is a silicon-based IGBT module manufactured by Microchip Technology. It features a three-phase bridge configuration housed in the SP3F package, designed for screw mount installation. The component operates within a junction temperature range of -40°C to +175°C and utilizes standard NTC thermistor integration for thermal monitoring. As part of the PM-IGBT-TFS-SP3F product line, it provides robust power switching capabilities suitable for industrial applications requiring high reliability and efficient thermal management.
Feature Summary
- Three-phase bridge topology for comprehensive power conversion
- Integrated NTC thermistor for precise thermal feedback
- SP3F packaging optimized for screw-mount mechanical stability
Applications
- Industrial motor drives
- Uninterruptible power supplies (UPS)
- Induction heating systems
Procurement Notes
Verify the specific datasheet revision and Product Change Notification (PCN) documents prior to procurement. Confirm that the ordering suffix matches the required pinout and electrical characteristics. Ensure compatibility with existing gate driver circuits and thermal interface materials. Cross-reference the manufacturer's latest documentation to validate current production status and lead times.
Selection Notes
Select this module based on its three-phase bridge configuration and SP3F form factor. Evaluate the thermal resistance characteristics relative to the intended heatsink design. Verify that the operating voltage and current ratings align with the system requirements. Consider the integrated NTC thermistor for implementing accurate temperature protection loops in the control architecture.
Part Context
This component belongs to Microchip's Power MOSFET and IGBT Modules portfolio, specifically under the PM-IGBT-TFS-SP3F series. It represents a discrete semiconductor solution designed for medium-power applications. The SP3F package is a standardized footprint facilitating interchangeability within compatible system designs requiring three-phase power stages.
Replacement Considerations
Direct replacements must match the SP3F package dimensions and pinout. Verify equivalent electrical parameters such as collector-emitter voltage and continuous current ratings. Ensure the replacement device supports the same mounting style and thermal management requirements.
