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MSCSM70AM025CD3AG is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is SIC 700V 538A D3. Review the specifications below when checking this part for your BOM.
FET, MOSFET Arrays specifications for MSCSM70AM025CD3AG
- Description：SIC 700V 538A D3
- Series：-
- Mfr：Microchip Technology
- Package：Tube
- Technology：Silicon Carbide (SiC)
- Configuration：-
- FET Feature：-
- Drain to Source Voltage (Vdss)：700V
- Current - Continuous Drain (Id) @ 25°C：538A (Tc)
- Rds On (Max) @ Id, Vgs：-
- Vgs(th) (Max) @ Id：-
- Gate Charge (Qg) (Max) @ Vgs：-
- Input Capacitance (Ciss) (Max) @ Vds：-
- Power - Max：-
- Operating Temperature：-
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：D3
- Grade：-
- Qualification：-
FET, MOSFET Arrays datasheet and documents for MSCSM70AM025CD3AG
FET, MOSFET Arrays Overview
The MSCSM70AM025CD3AG is a Silicon Carbide (SiC) MOSFET module manufactured by Microchip Technology. It utilizes the D3 package and features an N-channel configuration with a drain-source breakdown voltage of 700 V. The device has a maximum continuous drain current of 168 A and a typical on-resistance of 25 mOhms. Gate-source voltage limits are specified between -10 V and +25 V, with a threshold voltage of approximately 1.9 V. The module supports screw mounting and operates within a temperature range of -40°C to +125°C.
FET, MOSFET Arrays Feature Summary
- Utilizes Silicon Carbide semiconductor technology for superior thermal performance and high-temperature operation capabilities.
- Integrates an anti-parallel SiC Schottky diode to eliminate reverse recovery charge losses during switching transitions.
- Designed in a compact D3 package format suitable for screw-mount installation in power conversion systems.
FET, MOSFET Arrays Applications
- High-efficiency motor drives and inverters
- Industrial power supplies and converters
- Uninterruptible power supply (UPS) systems
FET, MOSFET Arrays Procurement Notes
Verify the specific suffix against official Microchip documentation to confirm exact electrical ratings and package variations. Confirm RoHS compliance status through the manufacturer's datasheet or product compliance reports before integration into regulated designs.
FET, MOSFET Arrays Selection Notes
Select this component for applications requiring low conduction losses and high thermal stability at elevated temperatures. Ensure the gate driver can accommodate the specified voltage limits and that the thermal management system supports the module's power dissipation characteristics within the operating temperature range.
FET, MOSFET Arrays Part Context
This module belongs to Microchip's PM-MOSFET-SIC-D3 series, which integrates SiC MOSFETs and SBDs in a standardized footprint. This series targets high-frequency power conversion needs where traditional silicon devices face efficiency limitations due to switching and thermal constraints.
FET, MOSFET Arrays Replacement Considerations
Consult official substitution lists for verified equivalents. Cross-referencing requires matching voltage, current, and thermal specifications precisely.
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