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MSCSM70HM038CAG is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is SIC MOSFET. Review the specifications below when checking this part for your BOM.
FET, MOSFET Arrays specifications for MSCSM70HM038CAG
- Description：SIC MOSFET
- Series：-
- Mfr：Microchip Technology
- Package：Tube
- Technology：-
- Configuration：-
- FET Feature：-
- Drain to Source Voltage (Vdss)：-
- Current - Continuous Drain (Id) @ 25°C：-
- Rds On (Max) @ Id, Vgs：-
- Vgs(th) (Max) @ Id：-
- Gate Charge (Qg) (Max) @ Vgs：-
- Input Capacitance (Ciss) (Max) @ Vds：-
- Power - Max：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
FET, MOSFET Arrays datasheet and documents for MSCSM70HM038CAG
FET, MOSFET Arrays Overview
The Microchip Technology MSCSM70HM038CAG is a silicon carbide (SiC) full bridge power module designed for high-efficiency power conversion. It features an N-channel configuration with a 700 V drain-source breakdown voltage and a continuous drain current of 464 A. The device exhibits a low on-resistance of 4.8 mOhms, enabling reduced conduction losses. Operating within a temperature range of -40°C to +175°C, it supports screw mounting in the SP6 package. Key switching parameters include a turn-on delay of 78 ns, turn-off delay of 214 ns, rise time of 125 ns, and fall time of 92 ns.
FET, MOSFET Arrays Feature Summary
- Utilizes silicon carbide technology for superior thermal performance and high-temperature operation up to 175°C.
- Integrates a full bridge topology within a single compact SP6 package to minimize parasitic inductance.
- Provides robust switching characteristics with optimized rise and fall times for efficient high-frequency applications.
FET, MOSFET Arrays Applications
- Industrial motor drives
- Uninterruptible power supplies
- High-efficiency AC/DC converters
FET, MOSFET Arrays Procurement Notes
Verify the specific suffix against official Microchip documentation to confirm exact electrical tolerances and pinout configurations. Ensure that the ordering part number matches the required package variant and thermal interface specifications. Cross-reference datasheet revisions to validate compliance with current manufacturing standards before procurement.
FET, MOSFET Arrays Selection Notes
Select this module for applications requiring high current density and wide bandgap efficiency. Evaluate thermal management requirements based on the specified power dissipation and junction temperature limits. Confirm gate drive compatibility with the recommended voltage ranges to ensure reliable switching performance and prevent device overstress during operation.
FET, MOSFET Arrays Part Context
This component belongs to Microchip's silicon carbide MOSFET module portfolio, specifically utilizing the SP6 packaging format. It is engineered for high-power density systems where traditional silicon devices face limitations. The series emphasizes reliability and reduced system size through integrated bridge configurations.
FET, MOSFET Arrays Replacement Considerations
Public confirmed substitute part numbers are not available in the provided source material. Consult official Microchip documentation for direct replacements or updated series equivalents.
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