RF Diode MSD700-19-1-R product image

MSD700-19-1-R

  • Description:RF DIODE STANDARD 15V DIE
  • Series:-

SKU:11f2fa2d10c9 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

MSD700-19-1-R is listed in the RF Diode range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is RF DIODE STANDARD 15V DIE. Review the specifications below when checking this part for your BOM.

RF Diode specifications for MSD700-19-1-R

  • Description:RF DIODE STANDARD 15V DIE
  • Series:-
  • Mfr:MACOM Technology Solutions
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Diode Type:Standard - Single
  • Voltage - Peak Reverse (Max):15V
  • Current - Max:-
  • Capacitance @ Vr, F:0.4pF @ 6V, 1MHz
  • Resistance @ If, F:1.2Ohm @ 25mA, 1MHz
  • Power Dissipation (Max):-
  • Operating Temperature:150°C (TJ)
  • Package / Case:Die
  • Supplier Device Package:Die
  • Grade:-
  • Qualification:-

RF Diode datasheet and documents for MSD700-19-1-R

MSD700-19-1-R

RF Diode Overview

The MSD700-19-1-R is a step recovery diode from the MSD7xx Series manufactured by MACOM Technology Solutions. It utilizes epitaxial silicon to deliver high output power and efficiency in harmonic generator applications. The device features a unique silicon dioxide passivation process that ensures stability, reliability, and low leakage currents at elevated temperatures. Designed for rugged operation, it meets environmental requirements of MIL-STD-750 and MIL-STD-883. Electrical specifications include a minimum voltage breakdown of 15 V at 10 µA, a minimum lifetime of 8 ns, and a maximum transition time of 60 ps under specified forward and reverse current conditions.

RF Diode Feature Summary

  • Epitaxial silicon construction provides high output power and efficiency for harmonic generation.
  • Silicon dioxide passivation process ensures stability and low leakage currents at high temperatures.
  • Capable of reliable operation in military, commercial, and industrial environments.
  • Manufactured using a proven fabrication process for high reproducibility.

RF Diode Applications

  • Harmonic generator applications
  • Frequency multiplication circuits
  • Military electronic systems
  • Industrial RF equipment

RF Diode Procurement Notes

Verify the specific suffix against official documentation to confirm package type and tape/reel configuration. Ensure ESD handling procedures are followed due to Class 0 HBM sensitivity. Confirm thermal management requirements align with pulsed thermal resistance ratings during integration.

RF Diode Selection Notes

Select based on required junction capacitance and series resistance values within the 15 V breakdown family. Evaluate transition time and lifetime parameters against target frequency multiplication orders. Verify compatibility with beam lead assembly methods such as thermo compression bonding or conductive epoxy.

RF Diode Part Context

This component belongs to the MSD7xx Series of step recovery diodes offered by MACOM. The series covers multiple voltage ratings (15 V, 20 V, 30 V, etc.) with varying capacitance ranges. The MSD700 variant specifically represents the 15 V minimum breakdown category with defined electrical limits for lifetime and transition time.

RF Diode Replacement Considerations

Consult official MACOM documentation for qualified substitutes within the MSD7xx series. Cross-reference junction capacitance and transition time specifications to ensure functional equivalence in harmonic generator designs.

RF Diode FAQ

What is the minimum voltage breakdown specification for the MSD700?

The minimum voltage breakdown is 15 V measured at 10 µA.

How is the transition time defined for this device?

The transition time is specified as a maximum of 60 ps when tested with a forward current of 6 mA and a reverse current of 10 mA.

What assembly methods are supported for the beam leads?

Beam leads may be attached to hybrid circuits using thermo compression bonding or conductive epoxy.

MSD700-19-1-RMSD700-19-1-R

Click on the inquiry