MSWSE-005-15

RF Diode Overview

The MSWSE-005-15 is a silicon PIN diode SPST switch element designed for medium incident power applications up to 4 W CW. It features low insertion loss and medium isolation below 6 GHz. Electrical specifications at +25°C include a breakdown voltage of 200 V, junction capacitance of 0.035 pF, total capacitance of 0.11 pF, series resistance of 2.0 Ω at 30 mA, and carrier lifetime of 180 ns. The device supports broadband performance up to 6 GHz with an I-layer thickness of 15 µm.

RF Diode Feature Summary

• Small size (50 x 30 mils)
• Broadband performance up to 6 GHz
• Supports up to 4 W power when cold switched
• Low insertion loss: 0.5 dB

RF Diode Applications

• Medium incident power applications
• SPST switch elements
• Broadband RF switching

RF Diode Procurement Notes

Verify the current revision status and datasheet version before procurement. Confirm RoHS compliance requirements against specific project standards. Ensure thermal management aligns with absolute maximum ratings. Check for any recent product change notifications that may affect specifications or packaging.

RF Diode Selection Notes

Select this component for applications requiring medium incident power handling up to 4 W CW. Consider the 50 x 30 mils footprint for space-constrained designs. Evaluate insertion loss and isolation requirements against the specified performance below 6 GHz. Ensure biasing conditions match the electrical specifications for optimal performance.

RF Diode Part Context

The MSWSE-005-15 belongs to MACOM's silicon PIN diode switch element family. It is part of the MSWSE series, which includes various models optimized for different power levels and frequency ranges. This specific model targets medium power applications with broadband capabilities.

RF Diode Replacement Considerations

Consult MACOM documentation for direct substitutes within the MSWSE series. Verify pinout compatibility and electrical parameters such as breakdown voltage and capacitance. Ensure thermal characteristics and package dimensions match the existing design constraints.