MT93L00AV

$90.11

Description：IC TELECOM INTERFACE 208LBGA
Series：-

SKU:e62b2abdcccf Category: Telecom Brand: Microsemi Corporation

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Product introduction

MT93L00AV is listed in the Telecom range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is IC TELECOM INTERFACE 208LBGA. Review the specifications below when checking this part for your BOM.

Telecom specifications for MT93L00AV

Description：IC TELECOM INTERFACE 208LBGA
Series：-
Mfr：Microsemi Corporation
Package：Tray
Function：Echo Cancellation
Interface：-
Number of Circuits：1
Voltage - Supply：3V ~ 3.6V
Current - Supply：65mA
Operating Temperature：-40°C ~ 85°C
Mounting Type：Surface Mount
Package / Case：208-LBGA
Supplier Device Package：208-LBGA (17x17)
Power (Watts)：-
Grade：-
Qualification：-

Telecom datasheet and documents for MT93L00AV

MT93L00AV

Telecom Overview

The MT93L00AV is a telecommunications integrated circuit designed for echo cancellation applications. It operates within a supply voltage range of 3V to 3.6V and draws a typical supply current of 65mA. The device is housed in a 208-LBGA package with dimensions of 17x17 mm, suitable for surface mount installation. It supports an operating temperature range from -40°C to 85°C. The component contains one circuit channel and is classified as a telecom interface IC. Note that this product is no longer in production.

Telecom Feature Summary

Integrated echo cancellation functionality for telecommunications interfaces
Surface-mountable 208-lead ball grid array packaging
Wide industrial operating temperature capability

Telecom Applications

Telecommunications equipment requiring echo cancellation
Interface circuits in telecom infrastructure

Telecom Procurement Notes

Verify component authenticity through authorized channels due to discontinued status. Confirm RoHS compliance requirements as the part does not meet current RoHS standards. Check for moisture sensitivity level handling during storage and assembly. Validate pin compatibility if replacing existing designs. Ensure supplier documentation matches the specific Microsemi manufacturing origin.

Telecom Selection Notes

Consider the 208-LBGA footprint constraints during PCB layout planning. Evaluate thermal management needs given the 65mA current draw and 17x17mm package size. Assess power supply stability within the 3V to 3.6V range for reliable operation. Verify temperature ratings against environmental conditions. Review end-of-life status implications for long-term maintenance strategies.

Telecom Part Context

This component belongs to the Microsemi (now Microchip) telecommunications interface portfolio. It serves as a specialized solution for echo cancellation in telecom systems. The LBGA package provides high-density interconnect capabilities. Discontinuation indicates availability through surplus or secondary markets only.