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The MUR10010CT is a silicon super fast recovery diode module manufactured by GeneSiC Semiconductor. It features a Twin Tower package with screw mount installation. The device supports a repetitive peak reverse voltage of 100 V and an average forward current of 100 A per package. Key electrical parameters include a maximum instantaneous forward voltage of 1.0 V, a maximum reverse recovery time of 75 ns, and a thermal resistance junction-to-case of 1.0 °C/W per leg. It operates within a temperature range of -55 °C to +150 °C.
Verify the specific datasheet revision date against the manufacturing batch to ensure compliance with current specifications. Confirm that the Twin Tower package dimensions match the intended PCB footprint or heatsink interface. Check for any regional shipping restrictions or export documentation requirements before finalizing orders.
Select this component when applications require high current handling combined with fast reverse recovery times. Ensure the operating junction temperature remains within the specified -55 °C to +150 °C range. Verify that the system's thermal management can maintain the case temperature below 140 °C to sustain the rated 100 A current.
This part belongs to the MUR100 series of silicon super fast recovery diodes from GeneSiC Semiconductor. The series offers various voltage ratings from 50 V to 200 V while maintaining consistent current and package characteristics. It serves as a robust solution for high-power industrial and commercial electronics.
Consult official manufacturer substitution lists for verified equivalents. Generic replacements may differ in thermal resistance or recovery time.