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The MUR10060CT is a silicon super fast recovery diode module manufactured by GeneSiC Semiconductor. It features a twin tower package configuration with one pair of common cathode standard diodes. The device supports a maximum repetitive peak reverse voltage of 600 V and an average forward current of 100 A per leg. Key electrical characteristics include a maximum instantaneous forward voltage of 1.7 V at 50 A and a maximum reverse recovery time of 110 ns. The module operates within a junction temperature range of -55°C to 150°C.
Verify the specific suffix designation against official documentation, as variations may indicate reversed lead configurations or specific thermal resistance ratings. Confirm that the requested component matches the exact voltage and current specifications required for the target circuit design before finalizing procurement orders.
Select this component for applications requiring high current capacity and fast switching speeds. Ensure the thermal management system can handle the junction-to-case thermal resistance. Verify that the peak reverse voltage rating exceeds the maximum circuit voltage spikes to prevent breakdown during operation.
This part belongs to the MUR100 series of silicon super fast recovery diodes from GeneSiC Semiconductor. The series offers various voltage ratings ranging from 400 V to 600 V while maintaining a consistent 100 A average forward current rating across the lineup.
Direct substitutes within the same series include the MUR10040CT for lower voltage requirements. Cross-brand replacements must match the 100 A current rating, 600 V blocking voltage, and twin tower package dimensions to ensure mechanical and electrical compatibility.
The maximum reverse recovery time is 110 ns.
No, the device is not ESD sensitive.
The maximum thermal resistance from junction to case is 1.0 °C/W per leg.