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The GeneSiC Semiconductor MUR20020CT is a silicon super fast recovery diode module featuring a twin tower package configuration. It provides a repetitive peak reverse voltage of 200 V and an average forward current rating of 200 A per package. The device exhibits a maximum instantaneous forward voltage of 1.0 V and a peak forward surge current capability of 2000 A per leg. Electrical characteristics include a maximum reverse recovery time of 75 ns and a maximum thermal resistance from junction to case of 0.45 °C/W per leg.
Verify the specific part number suffix against official documentation, as variations may indicate different lead configurations or packaging options. Confirm that the component meets all required electrical specifications for the intended application environment. Ensure compliance with relevant safety and environmental standards before integration into final products.
Select this component based on its 200 V reverse voltage rating and 200 A average forward current capacity. Consider the 75 ns reverse recovery time for high-speed switching requirements. Evaluate the thermal management needs relative to the 0.45 °C/W junction-to-case thermal resistance to ensure reliable operation within the specified temperature range.
This component belongs to the MUR200 series of silicon super fast recovery diodes manufactured by GeneSiC Semiconductor. The series offers various voltage ratings ranging from 50 V to 200 V while maintaining consistent current handling capabilities. These modules are designed for power electronics applications requiring fast switching speeds and high reliability.
Compatible substitutes within the same series include MUR20005CT and MUR20010CT, which share identical package dimensions and thermal characteristics but differ in reverse voltage ratings.