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The GeneSiC Semiconductor MUR2X060A02 is a Super Fast Recovery Rectifier module housed in an electrically isolated SOT-227 package. It features a maximum recurrent peak reverse voltage of 200 V and supports an average forward current of 120 A per package. The device provides a peak forward surge current capability of 900 A per leg with a maximum instantaneous forward voltage of 1.0 V. Key electrical parameters include a maximum reverse recovery time of 75 ns, an isolation voltage of 2500 V AC for one minute, and a thermal resistance junction-to-case of 0.8 °C/W. Operating temperatures range from -55 °C to +175 °C.
Verify the specific datasheet version and manufacturer documentation before procurement. Confirm that the SOT-227 package dimensions match the mechanical constraints of the target assembly. Ensure that the thermal management design accommodates the specified junction-to-case thermal resistance values under expected operating loads. Validate compliance with relevant industry standards for the intended application environment.
Select this component when a 200 V rating and 120 A average current are required within an isolated module form factor. Consider the 75 ns reverse recovery time for applications prioritizing switching speed over conduction losses. Evaluate the 0.8 °C/W thermal resistance against the available heatsinking capacity to ensure junction temperature limits are not exceeded during continuous operation.
This part belongs to the MUR2X series of super fast recovery rectifier modules manufactured by GeneSiC Semiconductor. These modules utilize silicon technology to provide high-performance rectification in a compact, isolated package. The series is designed for applications requiring high reliability and ruggedness in power electronics environments.
Public confirmed substitute part numbers are not available in the provided source material.