MURF30020

Description：DIODE MODULE GP 200V 150A TO-244
Series：-

SKU:d224c22a03ff Category: Diode Arrays Brand: GeneSiC Semiconductor

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Product introduction

Product Detailed Parameters

Description：DIODE MODULE GP 200V 150A TO-244
Series：-
Mfr：GeneSiC Semiconductor
Package：Bulk
Diode Configuration：1 Pair Common Cathode
Technology：Standard
Voltage - DC Reverse (Vr) (Max)：200 V
Current - Average Rectified (Io) (per Diode)：150A
Voltage - Forward (Vf) (Max) @ If：1 V @ 150 A
Speed：Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr)：-
Current - Reverse Leakage @ Vr：25 µA @ 200 V
Operating Temperature - Junction：-55°C ~ 150°C
Mounting Type：Chassis Mount
Package / Case：TO-244AB
Supplier Device Package：TO-244
Grade：-
Qualification：-

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MURF30020

Overview

The MURF30020 is a silicon super fast recovery diode module manufactured by GeneSiC Semiconductor. It features a common cathode configuration with a 200V reverse voltage rating and a 150A forward current capacity. The device utilizes a TO-244AB package designed for chassis mounting. Operating temperatures range from -55°C to +150°C. This component is classified as standard recovery with a speed greater than 500ns, suitable for general-purpose rectification applications requiring robust thermal performance.

Feature Summary

Utilizes silicon technology for high-temperature stability
Features a common cathode dual-diode configuration
Designed for secure chassis mounting via TO-244AB package

Applications

General-purpose rectification in power supplies
Industrial motor drive circuits
DC-DC converter output stages

Procurement Notes

Verify the obsolete status of this component before integration into new designs. Confirm that the TO-244AB chassis mount interface matches your thermal management infrastructure. Ensure that the 200V reverse voltage and 150A current ratings provide sufficient margin for your specific load conditions. Check for updated replacement recommendations from the manufacturer due to discontinuation.

Selection Notes

Select this module when a rugged, chassis-mountable solution is required for medium-power applications. The TO-244AB form factor offers reliable mechanical stability for high-current paths. Consider the standard recovery characteristics if switching speeds above 500ns are acceptable. Evaluate thermal dissipation requirements against the package's heat sinking capabilities.

Part Context

This part belongs to the GeneSiC Semiconductor diode module portfolio, focusing on silicon-based power rectification. The MURF series typically addresses industrial and automotive needs for durable power conversion components. The MURF30020 specifically targets applications needing high current handling within a standardized chassis-mount footprint.