MURP20020CT

MURP20020CT

$19.20
  • Description:DIODE MODULE GP 300V POWERTAP II
  • Series:SWITCHMODE™

SKU:458f72e63c82 Category: Brand:

  
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Product Detailed Parameters

  • Description:DIODE MODULE GP 300V POWERTAP II
  • Series:SWITCHMODE™
  • Mfr:onsemi
  • Package:Tray
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):300 V
  • Current - Average Rectified (Io) (per Diode):100A
  • Voltage - Forward (Vf) (Max) @ If:1 V @ 100 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):50 ns
  • Current - Reverse Leakage @ Vr:150 µA @ 300 V
  • Operating Temperature - Junction:-
  • Mounting Type:Chassis Mount
  • Package / Case:Powertap II
  • Supplier Device Package:PowerTap II
  • Grade:-
  • Qualification:-

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MURP20020CT

Overview

The MURP20020CT is a dual ultrafast rectifier module from onsemi, featuring two common cathode diodes in a single PowerTAP II package. It supports a maximum repetitive reverse voltage of 300 V and an average forward current of 100 A per diode. The device exhibits a fast recovery time characteristic typical of ultrafast rectifiers, with a maximum forward voltage drop of 1 V at 100 A. Designed for high-efficiency power conversion, it operates within a junction temperature range of -55°C to 175°C.

Feature Summary

  • Dual common cathode configuration in a compact PowerTAP II package
  • Ultrafast recovery characteristics for high-frequency switching applications
  • High thermal performance via direct soldering to PCB copper planes

Applications

  • High-frequency DC-DC converters
  • Free-wheeling diodes in synchronous rectification circuits
  • Output rectification in switch-mode power supplies

Procurement Notes

Verify the specific suffix against official datasheets to confirm pinout and thermal pad configuration. Confirm that the component meets required automotive or industrial reliability standards if applicable. Check for end-of-life status as this series may be obsolete. Ensure PCB layout accommodates the specific lead frame design of the PowerTAP II package for optimal heat dissipation.

Selection Notes

Select this component when high current handling and fast switching speeds are required in a compact form factor. The common cathode arrangement simplifies circuit topology for half-bridge or full-bridge configurations. Consider the thermal resistance capabilities relative to the expected ambient temperature and cooling methods available in the final assembly environment.

Part Context

This part belongs to onsemi's SWITCHMODE™ and PowerTAP II product lines, designed for robust power management solutions. The PowerTAP II package integrates the die directly onto a large thermal pad, eliminating traditional leads to reduce inductance and improve thermal conductivity compared to standard TO-220AB packages.

Replacement Considerations

Public confirmed substitute part numbers are not provided in the source material.

MURP20020CTMURP20020CT
$19.20
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