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The MURT30060 is a silicon super fast recovery diode module manufactured by GeneSiC Semiconductor. It features a three-tower package with an electrically isolated base plate and is not ESD sensitive. The device supports a repetitive peak reverse voltage of 600 V and an average forward current of 300 A per package. Key electrical characteristics include a maximum instantaneous forward voltage of 1.70 V at 150 A, a peak forward surge current of 2750 A, and a maximum reverse recovery time of 150 ns. Thermal resistance from junction to case is 0.40 °C/W per leg.
Verify the specific suffix designation against official documentation to confirm terminal configuration details. Confirm that the component meets all required thermal management specifications for the intended operating environment. Ensure compatibility with existing mounting hardware due to the specific three-tower package dimensions.
Select this module when high current handling and fast recovery times are critical. The 600 V rating suits medium-voltage applications. Consider the 0.40 °C/W thermal resistance for heat sink design. Verify that the 150 ns reverse recovery time aligns with the switching frequency requirements of the target circuit topology.
This component belongs to the MURT300 series of silicon super fast recovery diodes. The series includes variants with different voltage ratings, such as the MURT30040. These modules are characterized by their robust construction and isolation capabilities, suitable for industrial power electronics where reliability under high stress conditions is required.
MURT30040R
The maximum reverse recovery time is 150 ns.
Yes, the three-tower package features an electrically isolated base plate.
The peak forward surge current is 2750 A.