SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The MURTA30020 is a silicon super fast recovery diode module manufactured by GeneSiC Semiconductor. It features a heavy three tower package with an electrically isolated base plate. The device supports a repetitive peak reverse voltage of 200 V and an average forward current of 300 A per package. Key electrical parameters include a maximum instantaneous forward voltage of 1.0 V, a peak forward surge current of 2750 A, and a maximum reverse recovery time of 130 ns. The junction-to-case thermal resistance is 0.40 °C/W. Operating temperatures range from -55 °C to +150 °C.
Verify the specific part number suffix against official documentation to confirm terminal configuration details. Confirm that the component meets required RoHS compliance standards for your region. Ensure thermal management solutions align with the specified junction-to-case thermal resistance. Check for any end-of-life notifications or discontinuation notices from the manufacturer before finalizing procurement plans.
Select this module when high average current handling and fast switching speeds are required in a compact form factor. The isolated base plate allows for direct mounting to heatsinks without additional insulators. Consider the 2750 A surge rating for applications with significant inrush currents. Verify that the 200 V reverse voltage rating provides adequate margin for the circuit's peak inverse voltage requirements.
This component belongs to the MURTA300 series of silicon super fast recovery diodes. The series includes variants with different voltage ratings, such as the MURTA30040. These modules are designed for robust performance in demanding power electronics environments. The three tower package structure distinguishes them from standard dual-tower or stud-mounted alternatives.
Direct substitutes within the same series include the MURTA30040, which offers a higher voltage rating of 400 V while maintaining similar current capabilities. Verify pinout compatibility and thermal interface requirements when considering alternative packages.