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The MURTA30060R is a silicon super fast recovery diode module manufactured by GeneSiC Semiconductor. It features a heavy three tower package with an electrically isolated base plate and is not ESD sensitive. The device supports a repetitive peak reverse voltage of 600 V and an average forward current of 300 A per package. Key electrical characteristics include a maximum instantaneous forward voltage of 1.7 V, a peak forward surge current of 2750 A per leg, and a maximum reverse recovery time of 150 ns. The junction-to-case thermal resistance is 0.40 °C/W per leg. Operating temperatures range from -55 °C to +150 °C.
Verify the specific datasheet version and manufacturer documentation before procurement. Confirm that the component matches the required 600V rating and 300A current specifications. Ensure the installation environment accommodates the specified operating temperature range and thermal management requirements. Check for any regional shipping restrictions or export control documentation needs associated with this semiconductor product.
Select this component when high surge capability and fast recovery are critical for the application. The isolated base plate allows for direct mounting to heatsinks without additional insulators. Consider the 0.40 °C/W thermal resistance for heat sink sizing calculations. Verify that the 150 ns reverse recovery time meets the switching frequency requirements of the circuit design.
This part belongs to the MURTA300 series of silicon super fast recovery diodes from GeneSiC Semiconductor. The series includes variants with different voltage ratings ranging from 600 V to 1200 V. All parts in this series share the same heavy three tower package and common electrical characteristics regarding current capacity and thermal performance.
Direct substitutes within the same series include MURTA30080R and MURTA300100R for higher voltage applications. For lower voltage requirements, MURTA30040R may be considered if compatible with the system voltage. Ensure any replacement maintains the same package type and thermal resistance characteristics.