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The MX614P is a low-voltage, low-power CMOS integrated circuit designed for Bell 202 compatible half-duplex modem applications. It supports asynchronous data rates from 1200bps to 1800bps and includes optional 5bps and 150bps back-channel capabilities. The device operates on a supply voltage ranging from 3.0V to 5.5V, with typical operating currents of 1mA at 3.3V and 1µA in Zero-Power mode. It utilizes a standard 3.579545MHz crystal or external clock source. Key features include an optional receive filter equalizer, energy detection, and bidirectional data retiming functions that can eliminate the need for an external UART in microcontroller-based designs.
Verify package type compatibility during sourcing, as the MX614P specifically denotes the 16-pin PDIP variant. Confirm supply voltage requirements align with the 3.0V to 5.5V operational range. Ensure the design incorporates the required 3.579545MHz clock source, either via internal oscillator components or external drive. Review absolute maximum ratings to prevent damage from overvoltage conditions.
Select this component when a standalone Bell 202 modem solution is required without external digital signal processing. The MX614P is suitable for designs prioritizing low current consumption and simplified microcontroller interfaces through its built-in retiming logic. Consider the 16-pin PDIP package constraints regarding board space and thermal dissipation compared to surface-mount alternatives like the MX614DW.
The MX614 series comprises low-voltage CMOS modems manufactured by MX-COM, Inc., now part of CML Microcircuits. The MX614P represents the through-hole 16-pin PDIP version of this family, alongside surface-mount options like the SOIC (MX614DW) and TSSOP (MX614TN). This lineage focuses on providing cost-effective, single-chip solutions for legacy and specialized analog modem protocols.
Direct pin-compatible replacements within the same package are limited due to the specific CMOS architecture and timing characteristics. Designers may consider the MX614DW (SOIC) or MX614TN (TSSOP) if footprint adaptation is possible. Cross-family upgrades typically require schematic redesigns to accommodate different interface requirements.