NB2308AI2HDTR2G

Overview

The NB2308AI2HDTR2G is a 3.3 V zero delay clock buffer manufactured by onsemi, utilizing advanced 0.35 µm CMOS technology. It features an internal PLL that locks to a reference clock input and provides eight buffered outputs divided into two banks of four. This specific variant offers high-drive capabilities with faster rise and fall times compared to standard versions. The device supports an input frequency range from 15 MHz to 133 MHz and operates within a supply voltage window of 3.0 V to 3.6 V. It ensures low skew performance, with output-to-output skew less than 200 ps and device-to-device skew under 700 ps. The component is housed in a TSSOP-16 package.

Feature Summary

• Zero Delay Buffer with adjustable input-to-output propagation delay via capacitive load on the FBK pin
• High-drive output configuration (H suffix) for faster rise and fall times
• Configurable frequency multiplication: Bank A outputs Reference frequency; Bank B outputs Reference/2 frequency
• Low skew specifications: Output-to-output skew < 200 ps; Device-to-device skew < 700 ps

Applications

• Distributing high-speed clocks in multi-chip systems
• Clock buffering for processors and memory interfaces
• System testing applications using bypass mode

Procurement Notes

Verify the ordering suffix 'DT' corresponds to the TSSOP-16 package and 'R2G' indicates tape and reel packaging. Confirm RoHS compliance status as these are Pb-Free devices. Check current availability as this part number may be subject to End-of-Life notices or obsolescence based on manufacturer updates.

Selection Notes

Select the NB2308AI2HDTR2G when high-drive strength is required for heavy capacitive loads. Choose this model over the non-H variants if faster edge rates are necessary. Ensure the application requires the specific 1X/0.5X frequency configuration provided by the AI2 variant. Verify that the TSSOP-16 package fits the PCB layout constraints.

Part Context

This component belongs to the NB2308A family of 3.3 V zero delay buffers. The 'AI2' designation specifies the internal divider configuration allowing different frequencies per bank. The 'H' denotes the high-drive version, while 'DT' identifies the TSSOP-16 package type. The 'R2G' suffix typically indicates reel packaging and lead-free construction.

Replacement Considerations

Direct replacements include other NB2308A variants such as NB2308AI2DG or NB2308AI2DR2G if drive strength requirements are lower. For different packages, consider NB2308AI2DTG. Cross-vendor equivalents like Microchip PL123-09SC may offer similar functionality but require verification of electrical parameters.