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NC7SZ10L6X is listed in the Inverter Gates range at ChipApex. The manufacturer field lists onsemi. Its product description is IC GATE NAND 1CH 3-INP 6MICROPAK. Review the specifications below when checking this part for your BOM.
The NC7SZ10L6X is a single-channel NAND gate integrated circuit manufactured by onsemi, belonging to the TinyLogic UHS series. It features three inputs and operates within a supply voltage range of 1.65V to 5.5V. The device utilizes CMOS technology and is housed in a 6-MicroPak surface-mount package. Key electrical specifications include a maximum static current of 2 µA and output drive capabilities of 32mA for both high and low states. Propagation delay is specified at 7.5ns under 5V supply with 50pF load conditions. The component supports an operating temperature range from -40°C to +85°C.
Verify component authenticity through authorized distributors as the part status is obsolete. Confirm package integrity upon receipt since MicroPak packages are sensitive to moisture and physical handling. Check datasheet revisions for any parameter updates prior to final design integration. Ensure compatibility with existing PCB footprints if replacing active inventory.
Select this component when a single three-input NAND gate is required in space-constrained designs. Consider the 6-MicroPak package dimensions against available board real estate. Evaluate the 1.65V to 5.5V operating range against system power rails. Compare propagation delay specifications with timing requirements of the target application circuit.
This device belongs to onsemi's TinyLogic UHS family, which focuses on high-speed performance in ultra-small packages. The MicroPak packaging technology allows for significant board space savings compared to traditional leaded packages. This specific model represents a standard NAND function within that portfolio, designed for general digital applications.
Direct substitutes include 74LVC1G10FZ4-7 from Diodes Incorporated and 74LVC1G10GM variants from Nexperia. Verify pinout compatibility and logical equivalence before substitution. Note that these alternatives may have different packaging or thermal characteristics requiring layout adjustments.
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