NTSB30100CTT4G

Overview

The NTSB30100CTT4G is a dual common-cathode Schottky rectifier manufactured by onsemi. It features a 100V repetitive peak reverse voltage and a 30A average forward current rating per diode. The device utilizes a trench Schottky barrier technology to achieve low forward voltage drop while maintaining stable switching characteristics across a wide temperature range. It is housed in a TO-263-3 (D2PAK) surface-mount package with an exposed tab for thermal management, designed for high-efficiency power conversion applications.

Feature Summary

• Trench Schottky barrier technology provides lower forward voltage drop compared to planar devices without increased reverse leakage.
• Dual common-cathode configuration integrates two independent rectifiers in a single package for space-constrained designs.
• Stable switching characteristics are maintained over a wide operating temperature range.

Applications

• Output rectification in switched-mode power supplies (SMPS)
• Rectification in laptop adapters and AC/DC converters
• Power stages in ATX computer power supplies

Procurement Notes

Verify the specific ordering suffix T4G confirms tape-and-reel packaging when sourcing. Confirm RoHS compliance and halogen-free status through official manufacturer documentation or component material declarations prior to integration. Ensure the D2PAK footprint matches the design layout, paying attention to the thermal pad dimensions for proper heat dissipation requirements.

Selection Notes

Select this component for applications requiring high current handling at moderate voltages with strict efficiency targets. The trench technology offers superior performance over standard planar Schottky diodes regarding the trade-off between forward voltage and reverse leakage current. Consider the thermal resistance of the TO-263 package when designing heatsinking solutions for continuous 30A operation.

Part Context

This part belongs to onsemi's NTST series of trench Schottky rectifiers. The series is engineered to replace traditional planar Schottky diodes in high-frequency power supply designs. The dual common-cathode variant simplifies circuit topology by reducing component count and board space compared to using discrete single-diode packages.

FAQ

What is the primary advantage of the trench technology in this device?

The trench technology enables a lower forward voltage drop than planar Schottky diodes while preventing the high reverse leakage currents typically associated with reduced forward voltage in other technologies.

How is the thermal performance managed in the TO-263 package?

The package includes an exposed metal tab on the underside that connects to the cathode, allowing direct soldering to a PCB copper pour or heatsink to dissipate heat generated during high-current operation.