NXH400B100H4Q2F2PG

Overview

The NXH400B100H4Q2F2PG is a Q2BOOST power module containing two-channel flying capacitor boost circuits. It integrates Field Stop 4 IGBTs and 1200 V SiC Schottky diodes to minimize conduction and switching losses. The device features solder pins, a low inductive layout, and an integrated NTC thermistor. Key electrical ratings include a collector-emitter voltage of 1000 V, continuous collector current of 164 A at Tc=80°C, and maximum power dissipation of 396 W. Operating junction temperatures range from -40°C to 175°C.

Feature Summary

• Integrates Field Stop 4 IGBTs with 1200 V Silicon Carbide (SiC) Schottky diodes for reduced switching and conduction losses.
• Features a low inductive layout design optimized for high-frequency operation.
• Includes an integrated negative temperature coefficient (NTC) thermistor for thermal monitoring.
• Constructed as a lead-free and halide-free device.

Applications

• Solar Inverters
• Energy Storage Systems

Procurement Notes

Verify the specific ordering suffix 'PG' against official documentation to confirm the package variant. The datasheet indicates that the 'PG' suffix corresponds to press-fit pins, whereas the 'SG' suffix denotes solder pins. Ensure the selected pin configuration matches the intended mechanical assembly requirements before procurement.

Selection Notes

Select this module when designing two-channel flying capacitor boost topologies requiring high efficiency. Verify that the system's thermal management can maintain the case temperature within limits to support the rated 164 A continuous collector current. Confirm that the gate drive circuitry accommodates the specified internal gate resistance and threshold voltages.

Part Context

This component belongs to the NXH400B100H4Q2F2xG series manufactured by onsemi. It utilizes the PIM50 package form factor. The series includes variants with different termination styles, specifically distinguishing between solder pin and press-fit pin configurations within the same electrical specification framework.

Replacement Considerations

NXH400B100H4Q2F2SG is the electrically equivalent alternative featuring solder pins instead of press-fit pins. Verify mechanical footprint compatibility before substitution.

FAQ

What is the difference between the NXH400B100H4Q2F2PG and NXH400B100H4Q2F2SG?

The primary difference lies in the pin configuration. The PG suffix indicates press-fit pins, while the SG suffix indicates solder pins. Both share identical electrical characteristics and functionality.

Does the module include thermal protection components?

Yes, the module integrates an NTC thermistor for thermal monitoring purposes.