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The NXH400N100H4Q2F2SG-R is a Si/SiC hybrid IGBT module from onsemi's EliteSiC series, utilizing an I-Type Neutral Point Clamped (NPC) topology. It integrates high-performance trench field-stop IGBTs with rugged anti-parallel diodes and neutral point diodes. The device features solder pins in the Q2PACK PIM44 case outline (93x47 mm). Key electrical ratings include a collector-emitter voltage of 1000 V, continuous collector current of 409 A at TC=80°C, and maximum power dissipation of 959 W. It operates within a junction temperature range of -40°C to 175°C.
Verify the specific ordering suffix against official documentation to confirm pin configuration and packaging details. Ensure compatibility with system voltage requirements and thermal management constraints before integration. Confirm RoHS compliance status through manufacturer datasheets or certificates of conformity.
Select this module for applications requiring high current handling and low switching losses. Evaluate thermal resistance values and safe operating area limits under expected load conditions. Consider the internal gate resistor values when designing driver circuits to optimize switching performance and minimize electromagnetic interference.
This component belongs to the NXH400N100H4Q2F2 family, which includes variants with press-fit pins (PG) and solder pins (SG). The SG-R designation specifically indicates the solder pin version packaged in blister trays. These modules are part of onsemi's EliteSiC portfolio designed for industrial and renewable energy applications.
Direct replacements within the same family include NXH400N100H4Q2F2SG. Verify mechanical dimensions and pinout compatibility when substituting with other NPC modules. Cross-reference electrical characteristics such as saturation voltage and switching times to ensure equivalent performance.