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The OMAP3530DZCBBA is a HiRel applications processor based on the enhanced OMAP3 architecture, manufactured using 65-nm CMOS technology. It integrates an ARM Cortex-A8 core operating up to 600 MHz and a TMS320C64x+ DSP core running at 520 MHz. The device features a POWERVR SGX graphics accelerator, IVA2.2 subsystem, and extensive memory including 112 KB ROM and 64 KB L2 RAM. It supports LPDDR via Package-on-Package or discrete interfaces, offers up to 188 GPIOs, and operates within -40°C to +105°C.
Verify the specific suffix DZCBBA against the official Texas Instruments SPRS599D datasheet to confirm package type (CBC vs CBB) and pinout compatibility. Ensure design files account for the 515-pin s-PBGA configuration and verify that all required memory interfaces are supported by the selected package variant.
Select this component when extended temperature reliability and high-performance multimedia processing are required. The CBC package variant supports both POP memory stacking and discrete memory interfaces, offering flexibility in system design compared to other package options.
This part belongs to the OMAP3530-HiRel series, designed for robust performance in demanding environments. It shares the core architecture with commercial OMAP3530 devices but includes enhanced reliability features and specific packaging options suitable for specialized industrial and consumer electronics applications.
OMAP3525-HiRel