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OMAPL138AZCEA3 is listed in the Microprocessors range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC MPU OMAP-L1X 300MHZ 361NFBGA. Review the specifications below when checking this part for your BOM.
The OMAPL138AZCEA3 is a dual-core system-on-chip integrating an ARM926EJ-S RISC processor and a C674x fixed/floating-point VLIW DSP. Operating at 375 MHz with a 1.2V core voltage, it utilizes a 361-ball PBGA package with a 0.65mm pitch (ZCE). The architecture includes 16KB instruction and data caches for the ARM core, alongside 32KB L1P, 32KB L1D, and 256KB L2 cache for the DSP. It features 128KB of shared RAM, USB 2.0 OTG, SATA, Ethernet MAC, and PRU subsystems.
Verify the specific speed grade and package variant against project requirements. Confirm that the 375 MHz performance level meets application timing constraints. Ensure the 0.65mm pitch BGA footprint aligns with PCB design capabilities. Check for any specific revision errata relevant to the manufacturing date code.
Select this component when a balance of general-purpose processing and high-throughput algorithmic execution is required. The 375 MHz variant offers lower power consumption compared to the 456 MHz version. Consider the ZCE package dimensions if board space is limited. Evaluate the need for the PRU subsystem for deterministic tasks versus standard timer peripherals.
This device belongs to the Texas Instruments OMAP-L138 family, designed as a low-power applications processor. It targets OEMs and ODMs needing robust operating systems and rich user interfaces. The platform supports both fixed-point and floating-point operations within the DSP core, enabling efficient implementation of complex algorithms in embedded environments.
OMAPL138BZCED4E: Offers 456 MHz performance but requires 1.3V core voltage and has a different I/O voltage range.
Both the ARM926EJ-S and C674x cores operate at a maximum frequency of 375 MHz.
Yes, it includes TI Basic Secure Boot using SHA-1/SHA-256 and AES-128 for boot image validation and encryption.
The ZCE suffix indicates a 361-ball Pb-Free Plastic Ball Grid Array (PBGA) with a 0.65 mm ball pitch.
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