OSD32MP157F-512M-BAA

Microcontrollers, Microprocessor, FPGA Modules Overview

The OSD32MP157F-512M-BAA is a System-in-Package (SiP) module from Octavo Systems, integrating an STMicroelectronics STM32MP157 microprocessor. It features a dual-core Arm Cortex-A7 running at up to 800 MHz and a real-time Arm Cortex-M4 core operating at up to 209 MHz. The module includes 512 Mbyte of DDR3L memory, a STPMIC1 power management IC, EEPROM, MEMS oscillator, and passive components within an 18 mm x 18 mm BGA package. This integration supports high-performance computing with secure boot capabilities and extensive connectivity options for embedded applications.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Dual-core processor: Arm Cortex-A7 (up to 800 MHz) and Cortex-M4 (up to 209 MHz)
• Integrated 512 MByte DDR3L memory
• Compact 18 mm x 18 mm BGA footprint reducing board space by up to 64%
• Built-in security features including TrustZone and AES-256 encryption

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial IoT gateways
• Human Machine Interfaces (HMI)
• Real-time control systems

Microcontrollers, Microprocessor, FPGA Modules Part Context

This component belongs to the OSD32MP15x family of SiP modules designed to simplify hardware development by combining the STM32MP1 MPU with essential peripheral components. The 'F' suffix typically denotes specific pinout or configuration variants within the STM32MP157 series, while '512M' specifies the onboard memory capacity.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct replacements may include other Octavo Systems SiP modules like the OSD32MP15x series with different memory sizes, or discrete designs using the STM32MP157C/D/F SoC if board space allows. Verify pin compatibility and power requirements when substituting.