OSD3358-512M-ICB

Microcontrollers, Microprocessor, FPGA Modules Overview

The OSD3358-512M-ICB is a System-in-Package (SiP) module manufactured by Octavo Systems. It integrates an AM3358 ARM Cortex-A8 processor, 512MB DDR3 memory, and a TPS65217B power management unit within a single package. This integration consolidates the processing core, volatile memory, and power regulation into a compact form factor, designed to reduce printed circuit board space and simplify hardware design for embedded applications.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Integrates Texas Instruments AM3358 ARM Cortex-A8 processor
• Includes 512MB DDR3 memory on-board
• Features integrated TPS65217B Power Management IC (PMIC)
• System-in-Package architecture reduces component count and PCB area

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation controllers
• Medical devices requiring low power consumption
• Portable consumer electronics
• Smart home hubs and IoT gateways

Microcontrollers, Microprocessor, FPGA Modules Part Context

This part belongs to the OSD335x family of SiP modules from Octavo Systems. These modules are engineered to replace discrete SoC, memory, and PMIC combinations. The specific suffix 'ICB' denotes the commercial temperature range variant of the package, distinguishing it from industrial or extended temperature versions within the same product line.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct pin-to-pin replacements within the same manufacturer's portfolio include other variants in the OSD335x series with different memory capacities or temperature ratings, such as the OSD3358-512M-BSM. Cross-manufacturer substitution requires careful evaluation of the BGA footprint and internal signal routing, as the SiP architecture differs significantly from standard SoC packages.