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PC817XNNSZ1B is listed in the Transistor, Photovoltaic Output Optoisolators range at ChipApex. The manufacturer field lists SHARP/Socle Technology. Its product description is OPTOISOLATOR 1CH TRANS 4-DIP. Review the specifications below when checking this part for your BOM.
The PC817XNNSZ1B is a single-channel transistor output optocoupler manufactured by Sharp Microelectronics. It features a DIP-4 through-hole package and provides an isolation voltage of 5000 Vrms. Key electrical parameters include a minimum current transfer ratio of 80%, a maximum forward current of 50 mA, and a forward voltage of 1.4 V. The device supports a maximum collector-emitter voltage of 80 V and a maximum collector current of 8 mA. It operates within a temperature range of -30°C to +100°C.
Verify the specific suffix '1B' against official Sharp datasheets to confirm exact binning or packaging specifications. Ensure the supplier provides valid RoHS compliance documentation. Cross-reference the manufacturer part number with authorized distributor catalogs to avoid counterfeit components. Confirm that the DIP-4 package matches the intended PCB footprint requirements before procurement.
Select this component when a standard transistor output optocoupler with DIP-4 packaging is required. Consider the 80% minimum CTR for basic switching applications. Evaluate the 5000 Vrms isolation rating against system safety standards. Compare rise and fall times if speed requirements exceed typical general-purpose limits. Verify thermal dissipation capabilities within the specified operating temperature range.
This part belongs to the PC817 series of transistor output photocouplers from Sharp Microelectronics. The series is widely used for general-purpose isolation tasks. The 'XNN' designation typically indicates specific performance grading or configuration within the family. The DIP-4 form factor ensures compatibility with standard through-hole mounting processes.
Public confirmed substitute part numbers are not available in the provided source material.
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