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PCE85176AUG/DAKP is listed in the Display Drivers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC DRVR 160 SEGMENT DIE. Review the specifications below when checking this part for your BOM.
Display Drivers specifications for PCE85176AUG/DAKP
- Description：IC DRVR 160 SEGMENT DIE
- Series：-
- Mfr：NXP USA Inc.
- Package：Bulk
- Display Type：LCD
- Configuration：160 Segment
- Interface：I2C
- Digits or Characters：10 Characters, 20 Characters, 160 Elements
- Voltage - Supply：1.8V ~ 5.5V
- Operating Temperature：-40°C ~ 85°C
- Mounting Type：Surface Mount
- Package / Case：Die
- Supplier Device Package：Die
- Current - Supply：2.7 µA
- Grade：-
- Qualification：-
Display Drivers datasheet and documents for PCE85176AUG/DAKP
Display Drivers Overview
The PCE85176AUG/DAKP is an LCD segment driver die manufactured by NXP USA Inc. It interfaces with Liquid Crystal Displays (LCDs) featuring low multiplex rates, supporting up to 160 segments. The device operates as a peripheral component designed for Chip-On-Glass applications. It utilizes I2C-bus communication for control and data transfer. The unit is supplied as an uncased die, intended for integration into custom display modules where direct bonding to glass substrates is required.
Display Drivers Feature Summary
- Supports driving LCD displays with up to 160 segments
- Enables direct interface with low multiplex rate liquid crystal displays
- Facilitates Chip-On-Glass implementation through uncased die packaging
Display Drivers Applications
- Chip-On-Glass display module integration
- Low multiplex rate LCD segment driving
- Embedded display control systems requiring direct glass bonding
Display Drivers Procurement Notes
Verify the specific ordering suffix DAKP against the manufacturer's current documentation to confirm exact mechanical and electrical specifications. Ensure compatibility with the target LCD panel's multiplexing requirements before procurement. Confirm that the uncased die format aligns with the assembly capabilities of the manufacturing facility.
Display Drivers Selection Notes
Select this component when designing systems that require direct bonding of the driver to the glass substrate. It is suitable for applications needing support for up to 160 segments with low multiplex rates. Consider the I2C-bus interface requirements and the need for Chip-On-Glass processing capabilities during the design phase.
Display Drivers Part Context
This part belongs to the NXP LCD driver family, specifically engineered for segment-based displays. It serves as a peripheral interface between a microcontroller and the LCD panel. The die format distinguishes it from packaged ICs, targeting specialized assembly processes in display manufacturing.
Display Drivers Replacement Considerations
Consult official NXP documentation for verified substitute part numbers. Generic equivalents may not match the specific segment count or I2C-bus protocol requirements.
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